Specifications

Table Of Contents
Cinterion
®
TX62-W/TX82-W Hardware Interface Description
4.3 Mounting TX62/TX82 onto the Application Platform
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It is recommended to characterize land patterns before an actual PCB production, taking indi-
vidual processes, materials, equipment, stencil design, and reflow profile into account. For land
and stencil pattern design recommendations see also Section 4.3.1.1. Optimizing the solder
stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-
der voids, and to increase board level reliability.
Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in Section
4.3.3.
4.3.2 Moisture Sensitivity Level
TX62/TX82 comprises components that are susceptible to damage induced by absorbed mois-
ture.
Thales’s TX62/TX82 module complies with the latest revision of the IPC/JEDEC J-STD-020
Standard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional moisture sensitivity level (MSL) related information see Section 4.3.4 and Sec-
tion 4.4.2.