Specifications

Cinterion
®
TX62-W/TX82-W Hardware Interface Description
2 Interface Characteristics
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t TX62-W_TX62-W-x_TX82-W-x_HID_v01.200d 2022-09-08
Public / Preliminary
Page 22 of 170
2 Interface Characteristics
TX62/TX82 is equipped with an SMT application interface that connects to the external appli-
cation. The SMT application interface incorporates the various application interfaces as well as
the RF antenna interface.
2.1 Application Interface
2.1.1 Pad Assignment
The SMT application interface on the TX62/TX82 provides connecting pads to integrate the
module into external applications. The pads listed in Table 2 apply only to TX82-W, TX82-W-
B, TX62-W-B and TX62-W-C. Table 3 lists the common pads of TX62/TX82. Figure 8 (bottom
view) and Figure 7 (top view) show the connecting pads’ numbering plan of TX62-W (pads in-
side dark violet rectangle) as well as TX82-W, TX82-W-B, TX62-W-B and TX62-W-C (pads in-
side light violet rectangle).
As a rule all pads should be soldered for mechanical stability and heat dissipation.
Signal pads that are not used, i.e., marked as “rfu” (reserved for future use) or “nc” (not con-
nected), need to be soldered, but should not have an electrical connection to the external ap-
plication or GND. Also, pads marked as “rfu” are further qualified as “dnu” (do not use),
indicating that they are currently not supported, but internally connected for possible future us-
age. In addition, pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads,
as well as shared GPIO pads) are available with the embedded processing option only.
Please note that the reference voltages listed in Table 4 are the values measured directly on
the TX62/TX82 module. They do not apply to the accessories connected.
Note: Thales strongly recommends to provide test points for certain signal lines to and from
the module while developing SMT applications – for debug, test and/or trace purposes during
the manufacturing process. In this way it is possible to detect soldering (and other) problems.
Please refer to [5] and [6] for more information on test points and how to implement them. The
signal lines for which test points should be provided for are marked as “Test point recommend-
ed“ in Table 4.
Table 2: Overview: Pad assignments TX82-W, TX82-W-B, TX62-W-B and TX62-W-C additional pads
1
1. rfu = reserved for future use, i.e., currently not supported; dnu = do not use; nc = internally not connected
Pad no. Signal name Pad no. Signal name Pad no. Signal name
B5
GND E18 nc L5 nc
B6
nc E19 nc L6 nc
B18
nc G5 nc L18 nc
B19
GND G6 rfu (dnu) L19 nc
C5
nc G18 nc M5 GND
C6
nc G19 nc M6 nc
C18
nc J5 nc M18 nc
C19
nc J6 nc M19 GND
E5
nc J18 nc
E6
GPIO6 J19 nc