User's Manual

3. Recommended Soldering Profile
The data here is given only for guidance on solder and has to be adapted to your process and other reflow parameters for
example the used solder paste.
The paste manufacturer provides a reflow profile recommendation for his products.
Opposite side re-flow is prohibited due to module weight. Devices will withstand the specified profile and will withstand up
to 1 re-flows to a maximum temperature of 260 degree.
The re-flow soldering profile may only be applied if the COMO-N832C resides on the PCB side looking up. Heat above the
solder eutectic point while the COMO-N832C is mounted facing down may damage the module permanently