HP ProLiant DL580 G7 Server User Guide Part Number 595656-002 September 2010 (Second Edition)
© Copyright 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows Server are U.S.
Contents Component identification ............................................................................................................... 7 Front panel components ................................................................................................................................ 7 Front panel LEDs and buttons ......................................................................................................................... 8 Systems Insight Display .................................
Introduction ............................................................................................................................................... 35 Processor options ....................................................................................................................................... 35 Installing a processor ........................................................................................................................ 35 Memory options .................................
Integrated Management Log .............................................................................................................. 80 Remote support and analysis tools ............................................................................................................... 81 HP Insight Remote Support software ................................................................................................... 81 Keeping the system current ..........................................................
Brazilian notices ............................................................................................................................ 107 Canadian notices ........................................................................................................................... 107 Japanese notices ............................................................................................................................ 107 Taiwan notices ...........................................................
Component identification Front panel components Item Description 1 Serial and PID tag 2 Optical drive 3 Systems Insight Display 4 USB connectors (2) 5 Video connector 6 Processor memory drawer Component identification 7
Front panel LEDs and buttons Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server being managed remotely Off—Deactivated 2 Health LED Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) 3 NIC 1 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 4 NIC 2 LED Green—Linked to network Green (flashing)—Linked with activity
Systems Insight Display The Systems Insight Display LEDs represent the server and component layout.
Rear panel components Item Description Item Description 1 Power supply bay 4 (optional) 15 Expansion slot 2 (optional) 2 Power supply bay 3 (optional) 16 Expansion slot 3 (optional) 3 Power supply bay 2 17 Expansion slot 4 (optional) 4 Power supply bay 1 18 Expansion slot 5 (optional) 5 Mouse connector 19 Expansion slot 6 (optional) 6 Serial connector 20 PCIe2 x8 expansion slot 7 7 NIC 2 connector 21 PCIe2 x8 expansion slot 8 8 10Gb NIC adapter blank 22 PCIe2 x16 expansio
Rear panel LEDs and buttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing—Network activity Off—No network activity 2 iLO 3 NIC Link LED Green On—Linked to network Off—Not linked to network 3 NIC 2 Activity LED Green On or flashing—Network activity Off—No network activity 4 NIC 2 Link LED Green On—Linked to network Off—Not linked to network 5 NIC 4 Activity LED Green On or flashing—Network activity Off—No network activity 6 NIC 4 Link LED Green On
Power supply LED Power LED Status Off No AC power to power supply units. Check the AC power cord. Off AC is present. Standby output is on, output is disabled. Further indicated by the front panel LED. Off Power supply failure (includes overvoltage and overtemperature) further indicated by the Systems Insight Display LEDs. Green AC is present. Standby output is on, power supply DC output is on and OK.
System board components Item Description 1 Optional I/O expansion board connectors: • • PCI-X/PCI Express I/O expansion board PCI Express I/O expansion board 2 Slot 7 PCIe2 x8 (4, 2, 1) 3 Slot 8 PCIe2 x8 (4, 2, 1) 4 Slot 9 PCIe2 x16 (8, 4, 2, 1) 5 Slot 10 PCIe2 x8 (4, 2, 1) 6 Slot 11 PCIe2 x8 (8, 4, 2, 1) 7 SPI board connector 8 Internal USB connectors (2) 9 System maintenance switch 10 Optical drive connector 11 Video/USB connector 12 Solid state drive connector 13 Power butto
System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off. Position Description Function S1 iLO 3 Security Off = iLO 3 security is enabled. On = iLO 3 security is disabled. S2 Configuration lock Off = System configuration can be changed. On = System configuration is locked.
SPI board components Item Description 1 Mini SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data connector 5 RMII connector 6 SD card slot 7 Battery 8 10Gb NIC connector 9 NIC cache connector 10 NIC 3 connector 11 NIC 1 connector 12 Video connector 13 Keyboard connector 14 USB connectors (2) 15 iLO 3 connector 16 Mouse connector 17 Serial connector 18 NIC 2 connector 19 NIC 4 connector Component identification 15
I/O expansion board components • PCI-X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe2 x8 (4, 2, 1)* 3 Slot 3 PCIe2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI-X 5 Slot 1 PCI-X *Slot 4 is physically a x8 slot but operates electrically as a x4 slot.
*Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots. **Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. Processors and memory cartridges The processor memory drawer contains 4 processor sockets and 8 memory cartridges. For DIMM numbering, see "DIMM slot locations (on page 18)." For installation guidelines, see "Memory options (on page 41).
DIMM slot locations Each memory cartridge contains 8 DIMM slots. The lockstep banks are identified by the letters A through D. For installation guidelines, see "Memory options (on page 41).
Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application. On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible.
LED3 pattern LED4 pattern Interpretation — One blink every two seconds The system is powered down, and the cache contains data that has not yet been written to the drives. Restore system power as soon as possible to prevent data loss. Data preservation time is extended any time that 3.3 V auxiliary power is available, as indicated by LED 2. In the absence of auxiliary power, battery power alone preserves the data. A fullycharged battery can normally preserve data for at least two days.
FBWC module LEDs The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. Green LED Amber LED Interpretation Off On A backup is in progress. Flashing (1 Hz) On A restore is in progress. Flashing (1 Hz) Off The capacitor pack is charging. On Off The capacitor pack has completed charging.
Fan locations Power supply backplane components Component identification 23
Item Description 1 Graphics card power connector 2 Graphics card power connector 3 Graphics card power connector 4 SAS backplane power connector 5 Fan power connector Component identification 24
Operations Power up the server To power up the server, press the Power On/Standby button. Power down the server WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
2. Extend the server on the rack rails until the server rail-release latches engage. 3. After performing the installation or maintenance procedure, slide the server into the rack by pressing the server rail-release latches. Remove the access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed.
2. Extend the server from the rack (on page 25). 3. Open the locking latch, slide the access panel to the rear of the chassis, and remove the access panel. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch. Remove the processor memory drawer 1. Power down the server (on page 25). 2. Release the latches on the release lever. 3. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch.
4. Firmly holding the processor memory drawer, press the release buttons and then remove the drawer from the server. Access the Systems Insight Display To access the Systems Insight Display: 1. Press and release the panel. 2. After the display fully ejects, rotate the display downward to view the LEDs. Remove the SPI board To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25).
3. Remove the access panel (on page 26). 4. Disconnect all cables from the SPI board. IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial number through RBSU ("Re-entering the server serial number and product ID" on page 77). 5. Raise the levers, and lift the SPI board from the server. 6. Remove all components from the failed SPI board. To replace the component, reverse the removal procedure.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Optimum environment When installing the server, select a location that meets the environmental standards described in this section. Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack: • Leave a minimum clearance of 63.5 cm (25 in) in front of the rack. • Leave a minimum clearance of 76.2 cm (30 in) behind the rack. • Leave a minimum clearance of 121.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C (95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F). CAUTION: To reduce the risk of damage to the equipment when installing third-party options: • Do not permit optional equipment to impede airflow around the server or to increase the internal rack temperature beyond the maximum allowable limits. • Do not exceed the manufacturer’s TMRA.
Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks. • The stabilizing feet are attached to the rack if it is a single-rack installation. • The racks are coupled together in multiple-rack installations. • Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Powering up and configuring the server To power up the server, press the Power On/Standby button. While the server boots, RBSU and the ORCA utility are automatically configured to prepare the server for operating system installation. To configure these utilities manually: • Press the F8 key when prompted during the array controller initialization to configure the array controller using ORCA. • Press the F9 key when prompted during the boot process to change the server settings using RBSU.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
IMPORTANT: When either optional I/O expansion board is installed in a two-processor configuration, the second processor must be installed in socket 3 or 4. To install a processor, see the server user guide. To install the component: 1. Update the system ROM. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM. 2. Power down the server (on page 25). 3. Remove the processor memory drawer (on page 27).
5. Open the heatsink retaining bracket. 6. Open the processor retaining latch and the processor socket retaining bracket. 7. Remove the processor socket protective cover. IMPORTANT: Be sure the processor remains inside the processor installation tool.
8. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 9. Align the processor installation tool with the socket and install the processor.
10. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool. 11. Close the processor socket retaining bracket and the processor retaining latch.
12. Remove the heatsink protective cover. 13. Install the heatsink. 14. Close and lock the heatsink retaining bracket. 15. Install the processor memory drawer cover. 16. Install the processor memory drawer. 17. Power up the server (on page 25).
Memory options This server contains eight memory cartridge connectors in the processor memory drawer. Each memory cartridge can contain eight DIMMs, for a total of 64 DIMMs. The server supports the following DIMM speeds: • Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1066 MHz • Quad-rank PC3-8500 (DDR-1066) DIMMs operating at 1066 MHz Depending on the processor model, the memory clock speed may be reduced to 1066 or 800 MHz.
Although only one data rank is accessed at any given time for each DIMM, optimized command and address pipelining via various interleaving schemes enables the Intel® Xeon™ 7500-series processor architecture to benefit from dual-rank and quad-rank DIMMs. A dual-rank DIMM performs significantly better than its single-rank counterpart. A quad-rank DIMM provides further performance improvement even at the same DIMM capacity.
• DIMMs must be installed in pairs with identical characteristics. When possible, for configuration simplicity, HP recommends using DIMMs with identical part numbers throughout the system. • DIMM pairs must be populated in sequence by letter designation. Install DIMM pair (1A, 8A) first, followed by DIMM pair (3B, 6B), DIMM pair (2C, 7C) and DIMM pair (4D, 5D). The illustration below represents each processor/cartridge population.
o • If the configuration is two quad-rank 8-GB DIMMs and six dual-rank 8-GB DIMMs in a single cartridge configuration, the quad-rank DIMMs can be located in either of the corresponding white DIMM pairs (1A/8A or 3B/6B) as long as they are installed at the end point of the DDR3 channel. AMP modes Advanced ECC, Online Spare, and Mirrored Memory have further requirements beyond the ones listed here.
Memory subsystem architecture The Intel® Xeon™ 7500 processor memory architecture is designed to take advantage of multiple stages of memory interleaving to reduce latency and increase bandwidth. Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below. Each memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects to a memory buffer. The buffer converts SMI to DDR3 and expands the memory capacity of the system.
• In automatic mode, the BIOS enables Hemisphere mode if the system memory configuration is compatible with Hemisphere mode. • Hemisphere mode should produce the best overall performance for a variety of applications. However, Hemisphere mode can be disabled if it produces lower performance for a particular application.
To achieve the best performance for a given memory processor configuration, observe the following guidelines: • The largest contributor to maximum memory bandwidth performance is to use both memory controllers inside the processor. To achieve maximum memory bandwidth performance, populate both memory cartridges for each installed processor. • The second largest contributor to performance is to populate each DDR3 channel in each memory cartridge.
AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 73)." For the latest memory configuration information, see the QuickSpecs on the HP website (http://www.hp.com/go/ProLiant). Advanced ECC memory population guidelines Advanced ECC memory is the default memory protection mode for the server.
However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair locations.
3. Remove the processor memory drawer cover. 4. Remove the memory cartridge. 5. Open the memory cartridge cover. 6. Open the DIMM slot latches.
7. Install the DIMM. See "Memory options (on page 41)." 8. Close the memory cartridge cover. 9. Install the memory cartridge. 10. Install the processor memory drawer cover. 11. Install the processor memory drawer. 12. Power up the server. Hot-plug hard drive option When adding hard drives to the server, observe the following general guidelines: • The system automatically sets all device numbers. • If only one hard drive is used, install it in the bay with the lowest device number.
Drives should be the same capacity to provide the greatest storage space efficiency when drives are grouped together into the same drive array. For hard drive numbers, see "Device numbers (on page 18)." To install the component: 1. Remove the hard drive blank. 2. Prepare the SAS hard drive. 3. Install the hard drive. 4. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations.
Redundant hot-plug power supply option The server supports up to four hot-plug power supplies. Install all power supplies to provide full redundancy. HP recommends installing redundant hot-plug power supplies in pairs. To confirm the redundancy of your configuration, see the HP power advisor at the HP website (http://www.hp.com/go/hppoweradvisor). WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug.
3. Connect the power cord to the power supply. 4. Connect the power cord to the power source. 5. Be sure that the power supply LED is green ("Power supply LED" on page 12). 6. Be sure that the front panel external health LED is green ("Front panel LEDs and buttons" on page 8). Internal solid state drive expansion bay option 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove the access panel (on page 26). 4. Install the solid state drive.
The cable and the cable arrangement may appear differently from shown. 6. Install the access panel. 7. Slide the server back into the rack. 8. Power up the server (on page 25). Expansion board options The server supports up to 11 expansion slots. The server ships with 5 PCI Express expansion slots.
4. Open the expansion board retainer, and then remove the expansion slot cover. 5. Install the expansion board. 6. Install the shipping screw, if necessary. For more information, see "Securing an expansion board for shipping (on page 56)." 7. Close the expansion slot retainer. 8. Connect any required internal or external cables to the expansion board. 9. Install the access panel. 10. Power up the server (on page 25). 11. Resume normal server operations.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove the access panel (on page 26). 4. Remove the shipping screw. 5. Open the expansion board retainer.
6. Install the shipping screw. 7. Close the expansion slot retainer. 8. Install the access panel. 9. Slide the server back into the rack. 10. Power up the server (on page 25). 11. Resume normal server operations. Installing the PCI Express I/O expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed.
4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch.
6. Install the PCI Express I/O expansion board. 7. Install any expansion boards ("Installing a non-hot-plug expansion board" on page 55). 8. Slide the processor memory drawer back into the server. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 25).
4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch.
6. Install the PCI-X/PCI Express I/O expansion board. 7. Install any expansion boards ("Installing a non-hot-plug expansion board" on page 55). 8. Slide the processor memory drawer back into the server. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 25). HP NC524SFP Dual Port 10GbE Module option When installed on the SPI board, the HP NC524SFP Dual Port 10GbE Module provides two 10G NIC connectors for server I/O.
6. Install the mini-DIMM on the SPI board. 7. Install the SPI board. 8. Using a T-15 Torx screwdriver, remove the 10G NIC adapter blank. Save the retaining screw. 9. Install the HP NC524SFP module on the SPI board.
10. Secure the 10G NIC connectors to the chassis with the retaining screw. 11. Install the RJ-45 plugs on the bottom two RJ-45 connectors on the rear panel. 12. Install the access panel. 13. Slide the server back into the rack. 14. Connect the network cables. 15. Power up the server (on page 25). Battery-backed write cache module The HP BBWC protects against hard boot, power, controller, and system board failures.
The BBWC consists of two parts: a battery pack and a storage cache module. Along with the cache module, the battery pack provides transportable data protection, increases overall controller performance, and maintains any cached data for up to 72 hours after the server loses power. The NiMH batteries in the battery pack are continuously recharged through a trickle-charging process whenever the system power is on.
6. Attach the cable to the cache module. 7. Install the battery. 8. Connect the cable to the battery. The SPI board is not shown for clarity. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 25). FBWC module and capacitor pack option CAUTION: Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data.
To install the component: 1. Back up all data. 2. Close all applications. 3. Power down the server (on page 25). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. 4. Extend the server from the rack (on page 25). 5. Remove the access panel (on page 26). 6.
The SPI board is not shown for clarity. 10. Install the SPI board. 11. Install the access panel. 12. Slide the server back into the rack. 13. Power up the server (on page 25). HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections: 1. Installing the Trusted Platform Module board (on page 69). 2. Retaining the recovery key/password (on page 69). 3. Enabling the Trusted Platform Module (on page 70).
• When returning a system board for service replacement, do not remove the TPM from the system board. When requested, HP Service provides a TPM with the spare system board. • Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
6. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 13). 7. Install the TPM security rivet by pressing the rivet firmly into the system board. 8. Install the SPI board. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 25). Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2.
7. Reboot the server. 8. Enable the TPM in the OS. For OS-specific instructions, see the OS documentation. CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings.
Cabling DVD-ROM drive cabling Cabling 72
Server software and configuration utilities Configuration tools SmartStart software SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting in proven, reliable configurations.
• Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted.
To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted. For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation). Boot options Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device.
Configuring online spare memory To configure online spare memory: 1. Install the required DIMMs. 2. When the prompt appears, access RBSU by pressing the F9 key during power-up. 3. Select System Options. 4. Select Advanced Memory Protection. 5. Select Online Spare with Advanced ECC Support. 6. Press the Enter key. 7. Press the Esc key to exit the current menu, or press the F10 key to exit RBSU. For more information on online spare memory, see the HP website (http://h18000.www1.hp.
• Mozilla Firefox 2.0 or later For Linux servers, see the README.TXT file for additional browser and support information. For more information, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the Documentation CD or the HP website (http://www.hp.com). Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
Management tools Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.
• Remotely mount high-performance Virtual Media devices to the server. • Securely and remotely control the power state of the managed server. • Send alerts from iLO 3 regardless of the state of the host server. • Access advanced troubleshooting features through the iLO 3 interface. For more information about iLO 3 features (which may require an iLO Advanced Pack or iLO Advanced for BladeSystem license), see the iLO 3 documentation on the Documentation CD or on the HP website (http://www.hp.
• RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
o For NetWare: IML Viewer o For Windows®: IML Viewer o For Linux: IML Viewer Application • From within the iLO 3 user interface • From within HP Insight Diagnostics (on page 80) For more information, see the Management CD in the HP Insight Foundation suite for ProLiant.
website (http://www.hp.com/support). For more information, see the documentation provided with the SmartStart CD. If you do not use the SmartStart CD to install an OS, drivers for some of the new hardware are required. These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded from the HP website (http://www.hp.com/support). To directly locate the OS drivers for a particular server, enter the following web address into the browser: http://www.hp.
• Offline, automatic mode for HP ProLiant BL, DL, ML, and 100 Series servers • Firmware deployment support for HP ProLiant 100 Series servers HP Smart Update Manager The HP Smart Update Manager provides intelligent and flexible firmware and software deployment. This technology assists in reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the datacenter. HP SUM is delivered on The Smart Update Firmware DVD, ProLiant Support Packs, and Easy Set-up CDs.
Troubleshooting Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel. This symbol indicates the presence of electric shock hazards.
WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it.
Prepare the server for diagnosis 1. Be sure the server is in the proper operating environment with adequate power, air conditioning, and humidity control. For required environmental conditions, see the server documentation. 2. Record any error messages displayed by the system. 3. Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys. 4. Power down the server and peripheral devices if you will be diagnosing the server offline. If possible, always perform an orderly shutdown: a.
Service notifications To view the latest service notifications, refer to the HP website (http://www.hp.com/go/bizsupport). Select the appropriate server model, and then click the Troubleshoot a Problem link on the product page. Troubleshooting flowcharts To effectively troubleshoot a problem, HP recommends that you start with the first flowchart in this section, "Start diagnosis flowchart (on page 88)," and follow the appropriate diagnostic path.
General diagnosis flowchart The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the problem, or if the other flowcharts do not fix the problem, use the following flowchart. Item Refer to 1 "Symptom information (on page 86)" 2 "Loose connections (on page 87)" 3 "Service notifications (on page 88)" 4 The most recent version of a particular server or option firmware is available on the HP Support website (http://www.hp.com/support).
Item Refer to 5 "General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support) 6 Server maintenance and service guide, located on the Documentation CD or the HP website (http://www.hp.com/products/servers/platforms) 7 • Server maintenance and service guide, located on the Documentation CD or the HP website (http://www.hp.
Server power-on problems flowchart Symptoms: • The server does not power on. • The system power LED is off or amber.
• The external health LED is red or amber. • The internal health LED is red or amber. NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.
Troubleshooting 93
POST problems flowchart Symptoms: • Server does not complete POST NOTE: The server has completed POST when the system attempts to access the boot device.
Item Refer to OS boot problems flowchart Symptoms: • Server does not boot a previously installed operating system Troubleshooting 95
• Server does not boot SmartStart Possible causes: • Corrupted operating system • Hard drive subsystem problem • Incorrect boot order setting in RBSU Item Refer to 1 HP ROM-Based Setup Utility User Guide (http://www.hp.com/servers/smartstart) 2 "POST problems flowchart (on page 94)" 3 • "Hard drive problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.
Server fault indications flowchart Symptoms: • Server boots, but a fault event is reported by Insight Management Agents • Server boots, but the internal health LED, external health LED, or component health LED is red or amber Troubleshooting 97
NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation. Possible causes: • Improperly seated or faulty internal or external component • Unsupported component installed • Redundancy failure • System overtemperature condition Item Refer to 1 "Management agents" or in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.
POST error messages and beep codes For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support). WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating, or modifying system components.
Battery replacement If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
Canadian notice (Avis Canadien) Class A equipment This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.
Disposal of waste equipment by users in private households in the European Union This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Korean notice Class A equipment Class B equipment Chinese notice Class A equipment Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation. Each laser product complies with 21 CFR 1040.10 and 1040.
WARNING: Power products contain sealed lead-acid battery modules. A risk of fire and burns exists if the battery is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery. • Do not expose the battery to temperatures higher than 60°C (140°F). • Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water. The battery might explode.
Wireless devices You can install one or more integrated wireless devices. In some environments, the use of wireless devices might be restricted. Such restrictions might apply on airplanes, in hospitals, near explosives, or in other hazardous locations. Before you turn on this product, be sure that you understand local policies and have proper authorization. Do not co-locate or operate this device in conjunction with any other antenna or transmitter.
Taiwan notices Regulatory compliance notices 108
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Power supply output 910 W (low line) 1300 W (high line) HP ProLiant 1200 W power supply specifications Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 10 A at 100 VAC 4.
Technical support Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error messages • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authorized reseller: • See the Contact HP worldwi
• Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Technical support 118
Technical support 119
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache CSA Canadian Standards Association ESD electrostatic discharge FBWC flash-backed write cache IEC International Electrotechnical Commission iLO 3 Integrated Lights-Out 3 IML Integrated Management Log KVM keyboard, video, and mouse Acronyms and abbreviations 120
NIC network interface controller NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended PDU power distribution unit PID port ID POST Power-On Self Test PSP ProLiant Support Pack QPI QuickPath Interconnect RAS Reliability, Availability, Serviceability RBSU ROM-Based Setup Utility SAS serial attached SCSI SD Secure Digital Acronyms and abbreviations 121
SDDC Single Device Data Correction SFF small form-factor SIM Systems Insight Manager SMI Scalable memory interfaces SPI system peripheral interface TMRA recommended ambient operating temperature TPM trusted platform module UID unit identification UPS uninterruptible power system USB universal serial bus VCA Version Control Agent Acronyms and abbreviations 122
Index A AC power supply 111 access panel 26 ACU (Array Configuration Utility) additional information 84 airflow requirements 31 Array Configuration Utility (ACU) ASR (Automatic Server Recovery) authorized reseller 112 auto-configuration process 74 Automatic Server Recovery (ASR) 76 76 78 78 B Basic Input/Output System (BIOS) 75, 78, 89 battery 15, 100 battery pack LEDs 20 battery replacement notice 105 battery-backed write cache (BBWC) 15, 20, 64 battery-backed write cache battery pack 64 BBWC (battery-
external health LED 8 J F Japanese notice 104, 107 fans 23 FBWC module 22, 66 FCC rating label 101 features 7 Federal Communications Commission (FCC) notice 101, 102 flowcharts 88, 89, 91, 94, 95, 97 front panel buttons 8 front panel components 7, 9 front panel LEDs 8 K G general diagnosis flowchart 89 grounding methods 109 grounding requirements 32 H hard drive bays 7, 18 hard drive LEDs 19 hard drives, installing 51 hardware options 35 hardware options installation 33, 35 health driver 78 help reso
optimum environment 31 Option ROM Configuration for Arrays (ORCA) 77 options installation 33, 35 ORCA (Option ROM Configuration for Arrays) 77 OS boot problems flowchart 95 P PCI Express I/O expansion board, installing 58 PCI-X/PCI Express I/O expansion board, installing 60 phone numbers 112 population guidelines 48, 49 population guidelines, Advanced ECC 48 population guidelines, mirrored memory 49 population guidelines, online spare 48 POST error messages 99 POST problems flowchart 94 power button 8 powe
status lights, battery pack 20 support 81, 112 support packs 73 supported operating systems 82 switch, system maintenance 13 symbols on equipment 85 symptom information 86 system battery 15 system board components 13, 14 system board switches 14 system configuration settings 34, 73 system maintenance switch 13, 14 system power LED 8, 20 system, keeping current 81 Systems Insight Display 7, 9 Systems Insight Display, ejecting 28 W website, HP 112 wireless devices 107, 108 T Taiwan battery recycling notice
