Specifications

MSM800XEV/XEL / Design Considerations
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8.4 Thermal Specifications
The temperature is specified by 90°C for the BGA case. The table shows the allowable ambient temperature at various
airflows and with different heat sink configurations.
CPU: LX800 / T (case) = 90°C / Power consumption: 5W
Photo of heat sink
Heat sink type
Part Nr.
Product
MSM800…
CPU
Frequency
[MHz]
Air Temperature
(ambient)
T case:
No Airflow
0m/sec
T case:
Airflow
3m/sec
T case:
Airflow
6m/sec
No
heat sink
All
MSM800s
500 60°C 90°C
Small
807041
All
MSM800s
500 70°C 100°C 90°C 80°C
BEV 500 85°C

Large
807042
XEV
XEL
500 85°C
BEV
500 85°C - - -

Thermo-
junction
807043
(see Notes
below)
XEV
XEL
500 85°C - - -
 Two PC104 mounting holes are used for the large cooler.
 The thermojunction has been specifically designed by KCC to have 2 almost separate parts to provide distinct
heat dissipation for the CPU and the other onboard chips. The holes in the thermojunction are for ø2mm screws. The
holes in the casing/housing that will be attached to the thermojunction should be ø2.5 or 3mm.