HP ProLiant DL980 G7 Server User Guide Part Number AM426-9000A September 2010 (First Edition)
© Copyright 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows Server are U.S.
Contents Server component identification ...................................................................................................... 7 Front panel components ............................................................................................................................. 7 Front panel LEDs ....................................................................................................................................... 8 System Insight Display LEDs ................................
Installing a processor ..................................................................................................................... 35 Memory options ...................................................................................................................................... 40 DIMM support ............................................................................................................................... 40 Single-, dual-, and quad-rank DIMMs ...................................
System Online ROM flash component utility ...................................................................................... 79 iLO3 technology ............................................................................................................................ 79 Erase Utility .................................................................................................................................. 79 StorageWorks library and tape tools.....................................................
European Union regulatory notice ........................................................................................................... 105 Disposal of waste equipment by users in private households in the European Union ....................................... 105 Japanese notice .................................................................................................................................... 106 BSMI notice .............................................................................
Server component identification Front panel components Item Description 1 Hard drive bay 1 2 Hard drive bay 2 3 Hard drive bay 3 4 Hard drive bay 4 5 Hard drive bay 5 6 Hard drive bay 6 7 Hard drive bay 7 8 Hard drive bay 8 9 Optical drive bay 10 UID button and LED 11 Health LED 12 NIC 1 LED 13 NIC 2 LED 14 NIC 3 LED 15 NIC 4 LED 16 Power on/Standby button and LED 17 SID Server component identification 7
Item Description 18 USB connectors 19 Video connector 20 Processor memory tray (upper) 21 Processor memory tray (lower) Front panel LEDs Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server being managed remotely Off—Deactivated 2 Health LED Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) 3 NIC 1 LED Green—Linked to network Green (flashing)—Linked with activity
Item Description Status 7 Power on/Standby button and LED Amber—System has AC power and is in standby mode. Green—System has AC power and is powered on. Off—System has no AC power.
LED Component UPPER CPU ILK Upper processor memory drawer not fully seated PROC X Processor UPPER CPU Indicates upper CPU tray with associated CPUs, memory risers and DIMMs LOWER CPU Indicates lower CPU tray with associated CPUs, memory risers and DIMMs MEMORY BOARD X DIMM 1A-8D DIMM slot Processor and memory board configuration / logical (physical) location Upper processor memory board is shown on the left. Lower processor memory board is shown on the right.
Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application. On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible.
Item Description 10 Video connector 11 Keyboard connector 12 USB connectors 13 I/O expansion slots 14 Small form factor I/O expansion slots (optional) 15 XNC connectors 16 XNC management connector 17 Power supply 8 18 Power supply 7 19 Power supply 6 20 Power supply 5 21 Power supply 4 22 Power supply 3 23 Power supply 2 24 Power supply 1 Server component identification 13
Rear panel LEDs Item Description LED color Status 1 iLO3 NIC Activity LED Green On or flashing—Network activity Off—No network activity 2 iLO3 NIC Link LED Green On—Linked to network Off—Not linked to network 3 NIC 2 Activity LED Green On or flashing—Network activity Off—No network activity 4 NIC 2 Link LED Green On—Linked to network Off—Not linked to network 5 NIC 4 Activity LED Green On or flashing—Network activity Off—No network activity 6 NIC 4 Link LED Green On—Linked to net
Item Description LED color Status 7 NIC 3 Link LED Green On—Linked to network Off—Not linked to network 8 NIC 3 Activity LED Green On or flashing—Network activity Off—No network activity 9 NIC 1 Link LED Green On—Linked to network Off—Not linked to network 10 NIC 1 Activity LED Green On or flashing—Network activity Off—No network activity Power supply LED Power LED Status Off No AC power to power supply units Green AC is present. Standby output is on, output is disabled.
Fan location Server component identification 16
Item Description 1 Fan 4 2 Fan 3 3 Fan 2 4 Fan 1 5 Fan module 6 6 Fan module 5 Server component identification 17
System board components Item Description 1 Optional I/O expansion board connectors: • • PCI-X/PCI Express I/O expansion board PCI Express I/O expansion board 2 Slot 7 PCIe2 x4 (4, 2, 1) 3 Slot 8 PCIe2 x4 (4, 2, 1) 4 Slot 9 PCIe2 x8 (8, 4, 2, 1) 5 Slot 10 PCIe2 x4 (4, 2, 1) 6 Slot 11 PCIe2 x8 (8, 4, 2, 1) 7 SPI board connector 8 Internal USB connectors (2) 9 System maintenance switch 10 Optical drive connector 11 Video/USB connector 12 Solid state drive connector 13 Power button
System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off. Position Description Function S1 iLO3 Security Off = iLO3 security is enabled. On = iLO3 security is disabled. S2 Configuration lock Off = System configuration can be changed. On = System configuration is locked.
Expansion board components • PCI-X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe2 x4 (4, 2, 1) 3 Slot 3 PCIe2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI-X 5 Slot 1 PCI-X • PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x8 (8, 4, 2, 1) 2 Slot 5 PCIe2 x8 (8, 4, 2, 1) 3 Slot 4 PCIe2 x4 (4, 2, 1) 4 Slot 3 PCIe2 x8 (8, 4, 2, 1) 5 Slot 2 PCIe2 x8 (8, 4, 2, 1) 6 Slot 1 PCIe1 x4 (4, 2, 1) Server component identification 20
• Low profile I/O expansion board Item Description 1 Slot 12 Low profile PCIe2 x8 (4, 2, 1) 2 Slot 13 Low profile PCIe2 x8 (4, 2, 1) 3 Slot 14 Low profile PCIe2 x4 (2, 1) 4 Slot 15 Low profile PCIe x8 (4, 2, 1) 5 Slot 16 Low profile PCIe x8 (4, 2, 1) Server component identification 21
DIMM slot locations Each memory module contains 8 DIMM slots. The paired banks are identified by the letters A through D.
SAS hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible.
LED3 pattern LED4 pattern Interpretation — One blink every two seconds The system is powered down, and the cache contains data that has not yet been written to the drives. Restore system power as soon as possible to prevent data loss. Data preservation time is extended any time that 3.3 V auxiliary power is available, as indicated by LED 2. In the absence of auxiliary power, battery power alone preserves the data. A fullycharged battery can normally preserve data for at least two days.
Operations Power up the server To power up the server, press the Power On/Standby button. Power down the server WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
2. Extend the server on the rack rails until the server rail-release latches engage. 3. After performing the installation or maintenance procedure, slide the server into the rack by pressing the server rail-release latches. Remove the access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack. 3. Open the locking latch, slide the access panel to the rear of the chassis, and remove the access panel. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.
5. Remove the processor memory drawer cover. The procedure is the same for both the upper and lower processor memory drawer. Access the Systems Insight Display To access the Systems Insight Display: 1. Press and release the panel. 2. After the display fully ejects, rotate the display downward to view the LEDs.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Optimum environment When installing the server, select a location that meets the environmental standards described in this section. Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack: • Leave a minimum clearance of 63.5 cm (25 in) in front of the rack. • Leave a minimum clearance of 76.2 cm (30 in) behind the rack. • Leave a minimum clearance of 121.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C (95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F). CAUTION: To reduce the risk of damage to the equipment when installing third-party options: • Do not permit optional equipment to impede airflow around the server or to increase the internal rack temperature beyond the maximum allowable limits. • Do not exceed the manufacturer’s TMRA.
Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks. • The stabilizing feet are attached to the rack if it is a single-rack installation. • The racks are coupled together in multiple-rack installations. • Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Powering up and configuring the server To power up the server, press the Power On/Standby button. While the server boots, RBSU and the ORCA utility are automatically configured to prepare the server for operating system installation. To configure these utilities manually: • Press the F8 key when prompted during the array controller initialization to configure the array controller using ORCA. • Press the F9 key when prompted during the boot process to change the server settings using RBSU.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
To install the component: 1. Update the system ROM. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM. 2. Power down the server (on page 26). Remove the processor memory drawer (on page 28). 3. Remove the processor memory drawer cover. 4. Open the heatsink retaining bracket. 5. Open the processor retaining latch and the processor socket retaining bracket.
6. Remove the processor socket protective cover. IMPORTANT: Be sure the processor remains inside the processor installation tool. 7. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.
8. Align the processor installation tool with the socket and install the processor. 9. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
10. Close the processor socket retaining bracket and the processor retaining latch. 11. Remove the heatsink protective cover. 12. Install the heatsink.
13. Close and lock the heatsink retaining bracket. 14. Install the processor memory drawer cover. 15. Install the processor memory drawer. 16. Power up the server (on page 26). Memory options This server contains eight memory cartridge connectors in each processor memory drawer. Each memory cartridge can contain eight DIMMs, for a total of 128 DIMMs, for a maximum memory configuration of 2 TB.
Single-, dual-, and quad-rank DIMMs To understand and configure memory protection modes properly, an understanding of single-, dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications. A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one rank accessible at a time.
Item Description Definition 8500 = 1066-MHz 5 DIMM type R = RDIMM (registered) For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com). DIMM installation guidelines This server supports two memory cartridges per processor. Each memory cartridge can support up to eight DIMMs. Eight memory cartridges provide a total of 128 DIMMs per system.
o Advanced ECC memory population guidelines (on page 46) o Online Spare memory population guidelines (on page 46) o Mirrored Memory population guidelines (on page 47) Memory cartridge population guidelines This server contains eight memory cartridge slots in each processor memory drawer. Observe the following guidelines: • Memory must be loaded in quads, with a pair of DIMMs in each memory cartridge for a corresponding processor. Upper processor memory board is shown on the left.
• Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of the two memory controllers in the processor such that adjacent cache lines reside on different memory controllers, SMIs, DIMMs, and DIMM ranks for better performance. To take advantage of this feature, DIMMs should be populated evenly between all SMI channels.
• The largest contributor to maximum memory bandwidth performance is to use both memory controllers inside the processor. To achieve maximum memory bandwidth performance, populate both memory cartridges for each installed processor. This configuration is required for this server. • The second largest contributor to performance is to populate each DDR3 channel in each memory cartridge. To achieve this, the minimum DIMM count per cartridge is four DIMMs installed in DIMM pair locations A and B.
AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 73)." For the latest memory configuration information, see the QuickSpecs on the HP website (http://www.hp.com/go/ProLiant). Advanced ECC memory population guidelines Advanced ECC memory is the default memory protection mode for the server.
However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair locations.
4. Open the memory cartridge cover. 5. Open the DIMM slot latches. 6. Install the DIMM. See "Memory options (on page 40)." 7. Close the memory cartridge cover.
8. Install the memory cartridge. 9. Install the processor memory drawer cover. 10. Install the processor memory drawer. 11. Power up the server. Hot-plug hard drive option When adding hard drives to the server, observe the following general guidelines: • The system automatically sets all device numbers. • If only one hard drive is used, install it in the bay with the lowest device number. • Hard drives must be SFF types.
2. Prepare the SAS hard drive. 3. Install the hard drive. 4. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS hard drive LED combinations" on page 23). Redundant hot-plug power supply option The server supports up to four hot-plug power supplies. Install all power supplies to provide full redundancy. HP recommends installing redundant hot-plug power supplies in pairs.
1. Remove the power supply blank. 2. Slide the power supply into the power supply bay until the device locks into place. 3. Connect the power cord to the power supply. 4. Connect the power cord to the power source. 5. Be sure that the power supply LED is green ("Power supply LED" on page 15). 6. Be sure that the front panel external health LED is green. Internal solid state drive expansion bay option 1. Power down the server (on page 26). 2. Extend the server from the rack. 3.
The SPI board is not shown for clarity. 5. Connect the cable. The SPI board is not shown for clarity. The cable may appear differently than shown. 6. Install the access panel. 7. Slide the server back into the rack. 8. Power up the server (on page 26). Expansion board options In the main I/O tray the server supports up to 11 expansion slots. The server ships with 5 PCI Express expansion slots.
• PCI Express I/O Expansion Board—Adds six optional slots • PCI-X/PCI Express I/O Expansion Board—Adds five optional slots The server supports up to 5 low profile PCI Express expansion slots in the optional low profile PCI Express expansion module. Installing a non-hot-plug expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 1.
4. If installed, remove the shipping screws.
5. Open the expansion board retainer, and then remove the expansion slot cover. 6. Install the expansion board. 7. Install the shipping screw, if necessary. For more information, see "Securing an expansion board for shipping." 8. Close the expansion slot retainer. 9. Connect any required internal or external cables to the expansion board. 10. Install the access panel. 11. Power up the server (on page 26). 12. Resume normal server operations.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. IMPORTANT: When either optional I/O expansion board in installed in a two-processor configuration, the second processor must be installed in socket 3. 1. Power down the server (on page 26). 2. Extend the server from the rack. 3. Remove the access panel (on page 27). 4. Release the latches on the release lever. 5.
6. Install the PCI Express I/O expansion board. 7. Install any expansion boards. 8. Slide the processor memory drawer back into the server. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 26). Installing the PCI-X/PCI Express I/O expansion board CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed.
4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawer from the server until the release latches catch.
6. Install the PCI-X/PCI Express I/O expansion board. 7. Install any expansion boards. 8. Slide the processor memory drawer back into the server. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 26). Low profile I/O expander Power down the server (on page 26). 1. Press the release button, and open the lever.
2. Slide the I/O expander out of the server. Place a hand under the component to support it as you remove it from the server. 3. Press the side buttons to remove the component cover.
4. To open the I/O card lock, push the blue tab, flip it back, then open the hinge forward. 5. Remove expansion slot covers as necessary. To replace the component, reverse the removal procedure. HP NC524SFP Dual Port 10GbE Module option When installed on the SPI board, the HP NC524SFP Dual Port 10GbE Module provides two 10G NIC connectors for server I/O. When the HP NC524SFP module is installed, 1G NIC connectors 1 and 2 on the rear panel are unavailable.
6. Install the mini-DIMM on the SPI board. 7. Install the SPI board. 8. Using a T-15 Torx screwdriver, remove the 10G NIC adapter blank. Save the retaining screw. 9. Install the HP NC524SFP module on the SPI board.
10. Secure the 10G NIC connectors to the chassis with the retaining screw. 11. Install the RJ-45 plugs on the bottom two RJ-45 connectors on the rear panel. 12. Install the access panel. 13. Slide the server back into the rack. 14. Connect the network cables. 15. Power up the server (on page 26). Battery-backed write cache module The HP BBWC protects against hard boot, power, controller, and system board failures.
The BBWC consists of two parts: a battery pack and a storage cache module. Along with the cache module, the battery pack provides transportable data protection, increases overall controller performance, and maintains any cached data for up to 72 hours after the server loses power. The NiMH batteries in the battery pack are continuously recharged through a trickle-charging process whenever the system power is on.
6. Attach the cable to the cache module. 7. Install the battery. 8. Connect the cable to the battery. The SPI board is not shown for clarity. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 26). FBWC module and capacitor pack option CAUTION: Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data.
To install the component: 1. Back up all data. 2. Close all applications. 3. Power down the server (on page 26). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. 4. Extend the server from the rack. 5. Remove the access panel (on page 27). 6. Remove the SPI board. 7.
The SPI board is not shown for clarity. 10. Install the SPI board. 11. Install the access panel. 12. Slide the server back into the rack. 13. Power up the server (on page 26). HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections: 1. Installing the Trusted Platform Module board (on page 68). 2. Retaining the recovery key/password (on page 68). 3. Enabling the Trusted Platform Module (on page 69).
• When returning a system board for service replacement, do not remove the TPM from the system board. When requested, HP Service provides a TPM with the spare system board. • Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
6. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 18). 7. Install the TPM security rivet by pressing the rivet firmly into the system board. 8. Install the SPI board. 9. Install the access panel. 10. Slide the server back into the rack. 11. Power up the server (on page 26). Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2.
7. Reboot the server. 8. Enable the TPM in the OS. For OS-specific instructions, see the OS documentation. CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings.
Cabling XNC cabling For best cable management, follow the recommend connection order. 1. Make connections labeled 1 through 8 in the illustration.
2. Refer to cabling illustrations and table to make connections 9 though 16. For example, to make the ninth connection, to upper board 1, use the cable connected to lower board 4.
Server software and configuration utilities Configuration tools SmartStart software SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting in proven, reliable configurations.
• Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted.
To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted. By default, the auto-configuration process configures the system for the English language. To change any default settings in the auto-configuration process (such as the settings for language, operating system, and primary boot controller), execute RBSU by pressing the F9 key when prompted. After the settings are selected, exit RBSU and allow the server to reboot automatically.
2. When the prompt appears, access RBSU by pressing the F9 key during power-up. 3. Select System Options. 4. Select Advanced Memory Protection. 5. Select Online Spare with Advanced ECC Support. 6. Press the Enter key. 7. Press the Esc key to exit the current menu, or press the F10 key to exit RBSU. For more information on online spare memory, see the HP website (http://h18000.www1.hp.com/products/servers/technology/memoryprotection.html).
For more information, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the Documentation CD or the HP website (http://www.hp.com). HP Insight Control server deployment (formerly RDP) HP Insight Control is essential server management that unlocks the management capabilities built into HP ProLiant servers.
WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis. Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6.
System Online ROM flash component utility The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or controller ROM images across a wide range of servers and array controllers. This tool has the following features: • Works offline and online • Supports Microsoft® Windows NT®, Windows® 2000, Windows Server® 2003, Novell Netware, and Linux operating systems IMPORTANT: This utility supports operating systems that may not be supported by the server.
To access the Erase Utility, use the System Erase button on the home screen of the SmartStart CD ("SmartStart software" on page 73). StorageWorks library and tape tools HP StorageWorks L&TT provides functionality for firmware downloads, verification of device operation, maintenance procedures, failure analysis, corrective service actions, and some utility functions.
for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM. USB support HP provides both standard USB support and legacy USB support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.
NOTE: The current version of SmartStart provides the memory spare part numbers for the server. To download the latest version, see the HP website (http://www.hp.com/support). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
Insight Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight Remote Support Advanced. Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport). To download the software for free, go to Software Depot (http://www.software.hp.com). Select Insight Remote Support from the menu on the right.
Operating system version support Refer to the operating system support matrix (http://www.hp.com/go/supportos). System Online ROM flash component utility The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or controller ROM images across a wide range of servers and array controllers.
Battery replacement If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery.
Troubleshooting Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel. This symbol indicates the presence of electric shock hazards.
WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it.
Prepare the server for diagnosis 1. Be sure the server is in the proper operating environment with adequate power, air conditioning, and humidity control. For required environmental conditions, see the server documentation. 2. Record any error messages displayed by the system. 3. Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys. 4. Power down the server and peripheral devices if you will be diagnosing the server offline. If possible, always perform an orderly shutdown: a.
Service notifications To view the latest service notifications, refer to the HP website (http://www.hp.com/go/bizsupport). Select the appropriate server model, and then click the Troubleshoot a Problem link on the product page. Troubleshooting flowcharts To effectively troubleshoot a problem, HP recommends that you start with the first flowchart in this section, "Start diagnosis flowchart (on page 90)," and follow the appropriate diagnostic path.
General diagnosis flowchart The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the problem, or if the other flowcharts do not fix the problem, use the following flowchart. Item Refer to 1 "Symptom information (on page 88)" 2 "Loose connections (on page 89)" 3 "Service notifications (on page 90)" 4 The most recent version of a particular server or option firmware is available on the HP Support website (http://www.hp.com/support).
Item Refer to 5 "General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support) 6 Server maintenance and service guide, located on the Documentation CD or the HP website (http://www.hp.com/products/servers/platforms) 7 • Server maintenance and service guide, located on the Documentation CD or the HP website (http://www.hp.
Server power-on problems flowchart Symptoms: • The server does not power on. • The system power LED is off or amber.
• The external health LED is red or amber. • The internal health LED is red or amber. NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.
Troubleshooting 95
POST problems flowchart Symptoms: • Server does not complete POST NOTE: The server has completed POST when the system attempts to access the boot device.
Item Refer to OS boot problems flowchart Symptoms: • Server does not boot a previously installed operating system Troubleshooting 97
• Server does not boot SmartStart Possible causes: • Corrupted operating system • Hard drive subsystem problem • Incorrect boot order setting in RBSU Item Refer to 1 HP ROM-Based Setup Utility User Guide (http://www.hp.com/servers/smartstart) 2 "POST problems flowchart (on page 96)" 3 • "Hard drive problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.
Server fault indications flowchart Symptoms: • Server boots, but a fault event is reported by Insight Management Agents (on page 80) • Server boots, but the internal health LED, external health LED, or component health LED is red or amber Troubleshooting 99
NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation. Possible causes: • Improperly seated or faulty internal or external component • Unsupported component installed • Redundancy failure • System overtemperature condition Item Refer to 1 "Management agents (on page 80)" or in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.
POST error messages and beep codes For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support). WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating, or modifying system components.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
Canadian notice (Avis Canadien) Class A equipment This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.
European Union regulatory notice Products bearing the CE marking comply with the following EU Directives: • Low Voltage Directive 2006/95/EC • EMC Directive 2004/108/EC • Ecodesign Directive/2009/125/EC, where applicable • Machinery Directive 98/37/EEC CE compliance of this product is valid if powered with the correct CE-Marked AC adapter provided by HP.
Japanese notice BSMI notice Korean notice Class A equipment Class B equipment Regulatory compliance notices 106
Chinese notice Class A equipment Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation. Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No.
Taiwan battery recycling notice The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion. Contact a qualified Taiwanese recycler for proper battery disposal.
Brazilian notices Este equipamento opera em caráter secundário, isto é, não tem direito a proteção contra interferência prejudicial, mesmo de estações do mesmo tipo, e não pode causar interferência a sistemas operando em caráter primário. Canadian notices Wireless operation is subject to two conditions. The first is that the wireless device may not cause interference.
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental Specifications Specification Value System inlet temperature — Operating 10° to 35°C (50° to 95°F) at sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10°C/hr (18°F/hr). The upper limit may be limited by the type and number of options installed. System performance may be reduced if operating with a fan fault or above 30°C (86°F).
Specification Value Noise emissions were measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Idle L WAd 7.5 Bels L pAm 59.7 dB Operating L WAd 7.5 Bels L pAm 89.7 dB Emissions Classification (EMC) — FCC rating Class A Normative Standards CISPR 22; EN55022; EN55024; FCC CFR 47, Pt 15; ICES-003; CNS13438; GB9254; K22;K24; EN 61000-3-2; EN 61000-3-3; EN 60950-1; IEC 60950-1 Server Specifications Specification Value Dimension — Height 35.
Specification Value 1375W @ 200-240 VAC Maximum peak power 960 W @ 100 VAC 1080 W @ 110-120 VAC 1440 W @ 200-240 VAC *To ensure the server has sufficient power during normal operation, a server configured with eight populated CPU sockets or a detected high power GPU requires high line (200 - 240 V) ac server configuration.
Technical support Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error messages • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authorized reseller: • See the Contact HP worldwi
• Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Technical support 120
Technical support 121
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADU Array Diagnostics Utility AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache CSA Canadian Standards Association ESD electrostatic discharge FBWC flash-backed write cache GPU graphics processing unit IEC International Electrotechnical Commission iLO 3 Integrated Lights-Out 3 Acronyms and abbreviations 122
IML Integrated Management Log KVM keyboard, video, and mouse NIC network interface controller NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended PDU power distribution unit PID port ID POST Power-On Self Test PSP ProLiant Support Pack RBSU ROM-Based Setup Utility RDP Rapid Deployment Pack SAS serial attached SCSI Acronyms and abbreviations 123
SD Secure Digital SDRAM synchronous dynamic RAM SFF small form-factor SIM Systems Insight Manager SNMP Simple Network Management Protocol SPI system peripheral interface SSD support software diskette TMRA recommended ambient operating temperature TPM trusted platform module UID unit identification UPS uninterruptible power system USB universal serial bus VCA Version Control Agent Acronyms and abbreviations 124
Index A access panel 27 ACU (Array Configuration Utility) 76 additional information 86 ADU (Array Diagnostic Utility) 82 airflow requirements 31 Array Configuration Utility (ACU) 76 Array Diagnostic Utility (ADU) 82 ASR (Automatic Server Recovery) 78 authorized reseller 114 auto-configuration process 74 Automatic Server Recovery (ASR) 78 B Basic Input/Output System (BIOS) 75, 78, 91 battery 85 battery pack LEDs 24 battery replacement notice 107 battery-backed write cache (BBWC) 24, 63 battery-backed write
G general diagnosis flowchart 91 grounding methods 110 grounding requirements 32 H hard drive LEDs 11, 23 hard drives, installing 49 hardware options 35 hardware options installation 33, 35 health driver 78 help resources 114 HP Insight Diagnostics 81 HP Insight Remote Support software 82 HP ProLiant Essentials Foundation Pack 34, 80 HP ProLiant Essentials Rapid Deployment Pack 77 HP Systems Insight Manager overview 80 HP technical support 114 LEDs, Systems Insight Display 9 LEDs, troubleshooting 86 LEDs,
processor memory module 10, 27, 28 processor option 35 ProLiant Support Pack (PSP) 83 PSP (ProLiant Support Pack) 83 PSPs, overview 83 R rack installation 30, 33, 34 rack mounting hardware 33 rack resources 30 rack stability 87 rack warnings 33, 87 RBSU (ROM-Based Setup Utility) 73 RBSU configuration 74 recommended ambient operating temperature (TMRA) 31 recovery key 68 redundant ROM 80 registering the server 34 regulatory compliance identification numbers 102 regulatory compliance notices 102, 105 remote
V ventilation 31 Version Control 83 Version Control Agent (VCA) 83 Version Control Repository Manager (VCRM) 83 W website, HP 114 wireless devices 108, 109 Index 128
