HP ProLiant SL250s Gen8 Server User Guide Abstract This document provides detailed instructions to configure and use the HP ProLiant SL250s Gen8 Server.
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Confidential computer software.
Contents Component identification ............................................................................................................... 6 Front panel components ............................................................................................................................. 6 Front panel LEDs and buttons ...................................................................................................................... 7 Rear panel components .........................................
General DIMM slot population guidelines ......................................................................................... 32 Installing a DIMM .......................................................................................................................... 33 Drive guidelines ...................................................................................................................................... 34 Removing the hard drive blank ..................................................
HP Technology Service Portfolio ...................................................................................................... 73 Change control and proactive notification ........................................................................................ 73 Troubleshooting .......................................................................................................................... 74 Troubleshooting resources .......................................................................
Component identification Front panel components Item Description 1 Hot-plug hard drive, Bay 1 HDD 1 2 Hot-plug hard drive, Bay 1 HDD 2 3 Option bay 1, PCI riser board 4 Hot-plug hard drive, Bay 1 HDD 3 5 Hot-plug hard drive, Bay 1 HDD 4 6 Option bay 1, FlexibleLOM riser 7 SUV port 8 Serial port 9 NIC 1 network port 10 NIC 2 network port 11 iLO 4 network port Component identification 6
Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Green—System on Amber—System shut down, but power still applied. Off—Power cord is not attached, or power supply has failed. 2 Health LED Green—Normal Flashing amber—System degraded Flashing red—System critical 3 UID LED button Blue—Activated Flashing blue—System is being remotely managed.
Rear panel components The server has four power supplies, eight fans, and a single SLAPM interface located on the rear panel of the chassis. Item Description 1 SLAPM interface 2 Power supply 4 3 Power supply 3 4 Power supply 2 5 Power supply 1 Rear panel LEDs and buttons Item Description Status 1 Fan 8/16 power LED Off—Normal Amber—Fan has failed. 2 Fan 7/15 power LED Off—Normal Amber—Fan has failed.
Item Description Status Flashing blue—System is being remotely managed. Off—Deactivated 4 Fan 4/12 power LED Off—Normal Amber—Fan has failed. 5 Fan 3/11 power LED Off—Normal Amber—Fan has failed. 6 Fan 1/9 power LED Off—Normal Amber—Fan has failed. 7 Fan 2/10 power LED Off—Normal Amber—Fan has failed.
Item Description 4 SATA hard drive connector 2 5 System battery 6 Processor socket 2 7 Processor 2 DIMM slots 8 Power connector 9 RPS connector 10 x32 riser connector 11 Processor 1 DIMM slots 12 Processor socket 1 (populated) 13 Mini-SAS hard drive connector port 2i 14 Mini-SAS hard drive connector port 1i 15 Internal USB connector 16 uSD card slot 17 Data LED connector 18 x16 FlexibleLOM slot 19 System maintenance switch 20 Trusted Platform Module 21 NMI header NOTE:
The arrow points to the front of the node. System maintenance switch Position Default Function S1 Off Off = iLO 4 security is enabled. On = iLO 4 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = No function On = ROM reads system configuration as invalid.
NMI header The NMI header enables administrators to perform a memory dump before performing a hard reset. Crash dump analysis is an essential part of eliminating reliability issues, such as hangs or crashes in operating systems, device drivers, and applications. Many crashes can freeze a system, requiring you to perform a hard reset. Resetting the system erases any information that supports root cause analysis. When a Windows® operating system crashes, a blue-screen trap appears.
• Rear SFF hard drive bay numbers (box 0) Drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
Item LED Status Definition Off The drive is not configured by a RAID controller.
Operations Power up the server To power up the server, press the Power On/Standby button. Power down the node Before powering down the node for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the node is in standby mode, auxiliary power is still being provided to the system. To power down the node, use one of the following methods: • Press and release the Power On/Standby button.
3. Remove the server from the chassis (on page 15). 4. Place the node on a flat, level work surface. Remove the processor air baffle To remove the component: 1. Power down the server ("Power down the node" on page 15). 2. Disconnect all peripheral cables from the node. 3. Remove the server from the chassis (on page 15). 4. Remove the front GPU module. 5. Remove the GPU bracket. 6. Remove the air baffle. To replace the component, reverse the removal procedure.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack: • Leave a minimum clearance of 63.5 cm (25 in) in front of the rack. • Leave a minimum clearance of 76.2 cm (30 in) behind the rack. • Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.
Power requirements Installation of this equipment must comply with local and regional electrical regulations governing the installation of information technology equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992 (code for Protection of Electronic Computer/Data Processing Equipment).
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • • • • • The leveling jacks are extended to the floor. The full weight of the rack rests on the leveling jacks. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Installing components WARNING: The node is very heavy. To reduce the risk of personal injury or damage to the equipment: • Reduce the weight of the node by removing the hard drives and power supplies before installing the node into the rack. • Get help to lift and stabilize the node during installation. When the node weighs more than 22.5 kg (50 lb), two people might be required to install the node into the rack.
3. Connect peripheral devices to the server.
Powering up the chassis Connect the AC or DC power cables, depending on the power configuration. When the circuit breakers are powered, the chassis and HP ProLiant SL Advanced Power Manager have power. By default, each installed component also powers up. Examine the HP ProLiant SL Advanced Power Manager for any errors which may prevent installed components from powering up.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible node malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
8. Remove the clear processor socket cover. Retain the processor socket cover for future use. 9. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 11. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 12. Remove the thermal interface protective cover from the heatsink.
13. Install the heatsink. 14. Install the air baffle. 15. Install the server into the chassis. 16. Power up the server. Memory options IMPORTANT: This node does not support mixing RDIMMs and UDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization. The memory subsystem in this node can support RDIMMs or UDIMMs. Both types are referred to as DIMMs when the information applies to all three types.
while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM at 1.35V. This difference equates to up to 20% less power at the DIMM level with no performance penalty. Memory subsystem architecture The memory subsystem in this node is divided into channels. Each processor supports four channels, and each channel supports two DIMM slots, as shown in the following table.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank 2R = Dual-rank 4R = Quad-rank 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35v) U = Ultra low voltage (1.
is degrading. This configuration enables DIMMs that have a higher probability of receiving an uncorrectable memory error (resulting in system downtime) to be removed from operation. Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the node boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 66).
contents of the degraded rank to the online spare rank. The node then deactivates the failing rank and automatically switches over to the online spare rank. Lockstep memory configuration Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device. Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each channel must have identical HP part numbers.
• Each populated channel must have a spare rank. A single dual-rank DIMM is not a valid configuration. Lockstep Memory population guidelines For Lockstep memory mode configurations, observe the following guidelines: • Observe the general DIMM slot population guidelines (on page 32). • DIMM configuration on all channels of a processor must be identical. • In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.
9. Install the server into the chassis ("Installing the server into the chassis" on page 21). 10. Power up the server (on page 15). If you are installing DIMMs in online spare, mirrored, or lock-step configuration, configure this mode in RBSU ("HP ROM-Based Setup Utility" on page 66). For more information about LEDs and troubleshooting failed DIMMs, see "Systems Insight Display LED combinations.
2. Prepare the drive. 3. Install the drive. 4. Determine the status of the drive from the drive LED definitions (on page 13). Installing SFF quick-release drive cages 1. Power down the server ("Power down the node" on page 15). 2. Remove the server from the chassis (on page 15).
3. Remove the front GPU cage. 4. Remove the GPU bracket.
5. Attach the mini-SAS cable to the rear SAS port on the system board. 6. Attach the power connectors to the personality board. The power connectors can plug into either port on the personality board. 7. Install the GPU bracket. 8. Using the six M2.
9.
o Front drive cage o Rear drive cage 10. Install the quick-release drives in the front and rear drive cages ("Installing a quick-release drive" on page 40). 11.
o Left node o Right node 12. Install the front GPU cage. 13. Install the server into the chassis ("Installing the server into the chassis" on page 21). 14. Power up the server (on page 15). Installing a quick-release drive 1. Power down the server ("Power down the node" on page 15). 2. Remove the server from the chassis (on page 15). 3. Install a SFF quick-release drive cage ("Installing SFF quick-release drive cages" on page 35).
4. Install the quick-release drive. 5. Install the server into the chassis ("Installing the server into the chassis" on page 21). 6. Power up the server (on page 15). Controller options The node ships with HP Dynamic Smart Array B320i Controller. For more information about the controller and its features, see the HP Dynamic Smart Array RAID Controller User Guide on the HP website (http://www.hp.com/support/DSA_RAID_UG_en).
CAUTION: After the node is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached. IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the node is powered up, indicating that the battery pack is temporarily disabled.
Installing the FBWC capacitor pack WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the node before beginning any installation procedure. Improper grounding can cause ESD. 1. Back up all data on the node. 2. Power down the server ("Power down the node" on page 15). 3. Disconnect all peripheral cables from the node. 4.
o HP ProLiant SL250s Gen8 Server, left node o HP ProLiant SL250s Gen8 Server, right node Hardware options installation 44
9. Connect the FBWC cable to the cache module on the system board or to the controller card. 10. Install the server into the chassis ("Installing the server into the chassis" on page 21). 11. Power up the server (on page 15). Mini-SAS cable to a controller card 1. Power down the server ("Power down the node" on page 15). 2. Remove the server from the chassis (on page 15).
3. Remove the HDD cage. 4. Remove the front GPU.
5. Remove the bracket. 6. Remove the PCI cage. 7.
8. Connect the mini-SAS cable included in this kit to the controller card. 9. Install the PCI cage in the server. 10. Install the bracket. 11. Install the front GPU. 12. Install the HDD cage. 13. Disconnect the existing mini-SAS cable from the HDD cage.
14. Connect the mini-SAS cable included in this kit to the HDD cage. 15. Route the mini-SAS cable from the HDD cage to the controller card.
o Right node 16. Install the server into the chassis ("Installing the server into the chassis" on page 21). 17. Power up the server (on page 15). Expansion board options Installing an expansion board The node ships with PCIe riser boards and expansion slots. PCI-X expansion boards are supported with optional riser boards. 1. Power down the server ("Power down the node" on page 15). 2. Remove the server from the chassis (on page 15). 3. Remove the PCI riser board assembly. 4.
5. Install the expansion board into the slot until it seats firmly. To install an expansion board in PCI expansion slot 1, use the same procedures. 6. Install the PCI riser board assembly. IMPORTANT: The server does not power up if the PCI riser board assembly is not seated properly. 7. Connect any required internal cables to the expansion board. Refer to the documentation that ships with the expansion board. 8.
4. Install the PCI riser board assembly. IMPORTANT: The server does not power up if the PCI riser board assembly is not seated properly. 5. Install the server into the chassis ("Installing the server into the chassis" on page 21). 6. Power up the server (on page 15). Installing a FlexibleLOM riser assembly 1. Power down the server ("Power down the node" on page 15). 2. Remove the server from the chassis (on page 15). 3.
6. Power up the server (on page 15). Redundant hot-plug power supply option CAUTION: All power supplies installed in the node must have the same output power capacity. Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies.
3. Remove the protective cover from the connector pins on the power supply. WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the power cord to the power supply until the power supply is installed. 4. Install the redundant power supply into the bay until it clicks. 5. Connect the power cord to the power supply.
6. Use the strain relief clip from the server hardware kit to secure the power cord. 7. Route the power cord through the cable management solution. 8. Connect the power cord to the power source. 9. Be sure that the power supply LED is green. Connecting the SUV cable CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment.
Item Connector Description 3 Video For connecting a video monitor 4 USB For connecting up to two USB devices 5 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported node. This procedure includes three sections: 1. Installing the Trusted Platform Module board (on page 56). 2. Retaining the recovery key/password (on page 58). 3.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. 1. Power down the node (on page 15). 2. Extend the server from the rack. 3. Remove the access panel. 4. Remove the PCI riser board assembly. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
9. Slide the node into the rack. 10. Power up the node ("Power up the server" on page 15). Retaining the recovery key/password The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
HP ProLiant SL250s Gen8 Server, right node Front GPU cabling The following figures depict the power cable and throttling cable connections to the riser board.
• Right node Cabling 61
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO 4 enables and manages the Active Health System (on page 63) and also features Agentless Management. All key internal subsystems are monitored by iLO 4. SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed. Using iLO 4, you can do the following: • Access a high-performance and secure Remote Console to the server from anywhere in the world.
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can download from the HP website (http://www.hp.com/go/spp/download).
This functionality supports operating systems that are supported by the node. For operating systems supported by the node, see the HP website (http://www.hp.com/go/supportos). If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the server is booted to the ISO so that the server can be updated automatically with no user interaction or updated in interactive mode. For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).
Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key. IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does not prompt you for confirmation of settings before you exit the utility.
• Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key. Configuring AMP modes Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported by the server.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following: • POST • RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support Redundant ROM support The node enables you to upgrade or configure the ROM safely with redundant ROM support. The node has a single ROM that acts as two separate ROM images.
Software and firmware Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, download the SPP ("HP Service Pack for ProLiant" on page 65) from the HP website (http://www.hp.com/go/spp). Version control The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.
HP Technology Service Portfolio HP Technology Services offers a targeted set of consultancy, deployment, and service solutions designed to meet the support needs of the most business and IT environments. Foundation Care services deliver scalable hardware and software support packages for HP ProLiant server and industry-standard software. You can choose the type and level of service that is most suitable for your business needs.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
System battery If the server no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Vietnam compliance marking notice This marking is for applicable products only. Ukraine notice Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation: • Do not try to open the module enclosure. There are no user-serviceable components inside. • Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
Acoustics statement for Germany (Geräuschemission) Schalldruckpegel LpA < 70 dB(A) Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation) Nach ISO 7779:1999 (Typprüfung) Regulatory compliance notices 82
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) 130 W CPU option 10°C to 35°C (50°F to 77°F) Relative humidity (noncondensing)** — Operating 10% to 90% Nonoperating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048 m (10,000 ft) is applicable.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 91
Support and other resources 92
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADM Advanced Data Mirroring AMP Advanced Memory Protection ASR Automatic Server Recovery BMC baseboard management controller CSA Canadian Standards Association CSR Customer Self Repair DDDC Double Device Data Correction DDR double data rate ESD electrostatic discharge FBWC flash-backed write cache Acronyms and abbreviations 93
GPU graphics processing unit HDD hard drive HP SIM HP Systems Insight Manager HP SUM HP Smart Update Manager IEC International Electrotechnical Commission iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor LOM LAN on Motherboard NMI nonmaskable interrupt NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended Acronyms and abbreviations 94
POST Power-On Self Test RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack SAS serial attached SCSI SATA serial ATA SDDC Single Device Data Correction SFF small form factor SIM Systems Insight Manager SLAPM SL Advanced Power Manager SPP HP Service Pack for ProLiant SSD solid-state drive SUV serial, USB, video TMRA recommended ambient operating temperature Acronyms and abbreviations 95
TPM Trusted Platform Module UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 96
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Index A ACU (Array Configuration Utility) Advanced ECC memory 31, 32, air baffle 16 airflow requirements 17, 18 Array Configuration Utility (ACU) ASR (Automatic Server Recovery) authorized reseller 85 auto-configuration process 67 Automatic Server Recovery (ASR) 62, 69 68 69 70 E 70 B batteries, replacing 81 battery 75, 81 BIOS upgrade 62, 70 boot options 23, 67 BSMI notice 79 buttons 6, 7, 8 C cables 59, 77 cabling 45, 55, 59, 60 Canadian notices 77 Care Pack 17, 73 Change Control 73 chassis, removing
HP Smart memory 28 I identification number 76 iLO (Integrated Lights-Out) 62, 63, 64 IML (Integrated Management Log) 62, 64 Insight Diagnostics 64, 71 installation services 17 installation, server options 24 installing hardware 24 installing server into chassis 21 Integrated Lights-Out (iLO) 62 Integrated Management Log (IML) 64 Intelligent Provisioning 62, 64 Option ROM Configuration for Arrays (ORCA) 62, 70 options installation 24, 34, 50 ORCA (Option ROM Configuration for Arrays) 62, 70 P Korean noti
S safety considerations 19, 71 safety information 71 SAS cabling 45 SAS drive numbers 12 SAS hard drive 45 SATA drive numbers 12 scripted installation 65 serial number 68 series number 76 server features and options 24 server, installation 21 shipping carton contents 20 software 72 space requirements 18 specifications 62, 84 static electricity 83 support 85 supported operating systems 72 system battery 75 system board battery 81 system board components 9 System Erase Utility 65 system maintenance switch 11
