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TDA2003

10W CAR RADIO AUDIO AMPLIFIER

DESCRIPTION

The TDA 2003 has improved performance with the

same pin configuration as the TDA 2002.

The additional features of TDA 2002, very low

number of external components, ease of assembly,

space and cost saving, are maintained.

The device provides a high output current capability

(up to 3.5A) very low harmonic and cross-over

distortion.

Completely safe operation is guaranteed due to

protection against DC and AC short circuit between

all pins and ground, thermal over-range, load dump

voltage surge up to 40V and fortuitous open

ground.

October 1998

Symbol Parameter Value Unit

Peak supply voltage (50ms) 40 V

DC supply voltage 28 V

Operating supply voltage 18 V

Output peak current (repetitive) 3.5 A

Output peak current (non repetitive) 4.5 A

Ptot Power dissipation at Tcase = 90°C 20 W

stg

, T

Storage and junction temeperature -40 to 150 °C

ABSOLUTE MAXIMUM RATINGS

TEST CIRCUIT

PENTAWATT

ORDERING NUMBERS :

TDA 2003H

TDA 2003V

1/10

Summary of content (10 pages)

PAGE 1
TDA2003 ® 10W CAR RADIO AUDIO AMPLIFIER DESCRIPTION The TDA 2003 has improved performance with the same pin configuration as the TDA 2002. The additional features of TDA 2002, very low number of external components, ease of assembly, space and cost saving, are maintained. The device provides a high output current capability (up to 3.5A) very low harmonic and cross-over distortion.
PAGE 2
TDA2003 PIN CONNECTION (top view) SCHEMATIC DIAGRAM THERMAL DATA Symbol Rth-j-case 2/10 Parameter Thermal resistance junction-case max Value Unit 3 °C/W
PAGE 3
TDA2003 AC TEST CIRCUIT DC TEST CIRCUIT ELECTRICAL CHARACTERISTICS ( Vs = 14.4V, Tamb = 25 °C unless otherwise specified) Symbol Parameter Test conditions Min. Typ. Max. Unit 18 V 6.9 7.7 V 44 50 mA DC CHARACTERISTICS (Refer to DC test circuit) Vs Supply voltage Vo Quiescent output voltage (pin 4) Id Quiescent drain current (pin 5) 8 6.1 AC CHARACTERISTICS (Refer to AC test circuit, Gv = 40 dB) Po Vi(rms) Vi Output power d = 10% f = 1 kHz RL = 4Ω RL = 2Ω RL = 3.2Ω RL = 1.
PAGE 4
TDA2003 ELECTRICAL CHARACTERISTICS (continued) Symbol Parameter B Frequency response (-3 dB) d Distortion Test conditions Po = 1W RL = 4Ω f = 1 kHz Po = 0.05 to4.5W RL = 4Ω Po = 0.05 to 7.5W RL = 2Ω Ri Input resistance (pin 1) f = 1 kHz Gv Voltage gain (open loop) f = 1 kHz f = 10 kHz Gv Voltage gain (closed loop) f = 1 kHz RL = 4Ω eN Input noise voltage iN Input noise current η Efficiency SVR Supply voltage rejection Min. 70 39.3 Typ. Max. Unit 40 to 15,000 Hz 0.15 0.
PAGE 5
TDA2003 Figure 4. Output power vs. load resistance RL Figure 5. Gain vs. input sensivity Figure 6. Gain vs. input sensivity F ig ure 7. Di stortion vs. output power Fi gure 8. Distor tion vs. frequency Figure 9. Supply voltage rejection vs. voltage gain Figure 10. Supply voltage rejection vs. frequency Figure 11. Power dissipation and efficiency vs. output power (RL = 4Ω) Figure 12. Power dissipation and efficiency vs.
PAGE 6
TDA2003 Figure 13. Maximum power dissipation vs. supply voltage (sine wave operation) Figure 14. Maximum allowable power dissipation vs. ambient temperature Figure 15. Typical values of capacitor (CX) for different values of frequency reponse (B) APPLICATION INFORMATION Figure 16. Typical application circuit Figure 17. P.C. board and component layout for the circuit of fig.
PAGE 7
TDA2003 Figure 18. Figure 19. Short-circuit (AC and DC conditions) In particular, the TDA 2003 can drive a coupling transformer for audio modulation. The TDA 2003 can withstand a permanent shortcircuit on the output for a supply voltage up to 16V. Polarity inversion High current (up to 5A) can be handled by the device with no damage for a longer period than the blow-out time of a quick 1A fuse (normally connected in series with the supply).
PAGE 8
TDA2003 PRATICAL CONSIDERATION Printed circuit board The layout shown in fig. 17 is recommended. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground of the output through which a rather high current flows. Assembly suggestion No electrical insulation is required between the package and the heat-sink. Pin length should be as short as possible. The soldering temperature must not exceed 260°C for 12 seconds.
PAGE 9
TDA2003 DIM. A C D D1 E E1 F F1 G G1 H2 H3 L L1 L2 L3 L4 L5 L6 L7 L9 M M1 V4 MIN. mm TYP. 2.4 1.2 0.35 0.76 0.8 1 3.2 6.6 3.4 6.8 10.05 17.55 15.55 21.2 22.3 17.85 15.75 21.4 22.5 2.6 15.1 6 4.23 3.75 0.2 4.5 4 MAX. 4.8 1.37 2.8 1.35 0.55 1.19 1.05 1.4 3.6 7 10.4 10.4 18.15 15.95 21.6 22.7 1.29 3 15.8 6.6 MIN. inch TYP. 0.094 0.047 0.014 0.030 0.031 0.039 0.126 0.260 0.134 0.268 0.396 0.691 0.612 0.831 0.878 0.703 0.620 0.843 0.886 0.102 0.594 0.236 4.75 0.167 4.25 0.148 40˚ (typ.) 0.
PAGE 10
TDA2003 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice.