Data Sheet

Component
Recommmended
value
Purpose
Larger than
recommended value
Smaller than
recommended value C1
C1
2.2
µ
F
Input DC
decoupling
Noise at switch-on,
switch-off
C2
470
µ
F
Ripple rejection Degradation of SVR
C3
0.1
µ
F
Supply bypassing Danger of oscillation
C4
1000
µ
F
Output coupling to load Higher low frequency
cutoff
C5
0.1
µ
F
Frequency stability Danger of oscillation at
high frequencies with
inductive loads
C
X
≅
1
2
π
B R1
Upper frequency cutoff Lower bandwidth Larger bandwidth
R1
(G
v
-1)
•
R2
Setting of gain Increase of drain current
R2
2.2
Ω
Setting of gain
and SVR
Degradation of SVR
R3
1
Ω
Frequency stability Danger of oscillation at
high frequencies with
inductive loads
R
X
≅
20 R2
Upper frequency cutoff Poor high frequency
attenuation
Danger of oscillation
PRATICAL CONSIDERATION
Printed circuit board
The layout shown in fig. 17 is recommended. If
different layouts are used, the ground points of
input 1 and input 2 must be well decoupled from
the ground of the output through which a rather high
current flows.
Assembly suggestion
No electrical insulation is required between the
package and the heat-sink. Pin length should be as
short as possible. The soldering temperature must
not exceed 260
°
C for 12 seconds.
Application suggestions
The recommended component values are those
shown in the application circuits of fig. 16.
Different values can be used. The following table is
intended to aid the car-radio designer.
8/10
TDA2003