Datasheet

DATE REVISION APPROVAL BY
DIMENSION
DRAW BY
APPROVAL BY
DATE
mm
Vivian Lai
Rikki
26-08-2014
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2
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A
B C D E F G H
SUGO INDUSTRIAL CO., LTD.
TEL : [phone] FAX : [phone]
Email : [e-mail]
PART No
NAME
SMD package to DIP Converter Board
SOP10-SOT23
10.30
12.5
0.5mm
1
2
3
SOT89
side 1
side 2
2.54
Function:
SOP10 & SOT23 package to DIP
Technical Data:
Board Material FR-4
SOP10 (side 1)
SOT23 (side 2)
0.5 (Side 1)
0.95 (Side 2)
Board Thickness 1.6mm ± 0.1mm
Surface Technioque Spray tin 5-8um
Copper Thickness 35um ± 5um
Solderability 260°C at 3s - 1.1%
Flammability V-0
Surface Resistivity 1.0 x 106 MΩ
Volume Resistivity 1.0 x 108 MΩ - cm
Arc Resistance 125sec.
Pitch
SMD package
4
10
9
8
7
0.95mm
5 6
SOP10
1
2
3
4
5
10
9
8
7
6
SOT23
mm ±0.2