Datasheet
DATE REVISION APPROVAL BY
DIMENSION
DRAW BY
APPROVAL BY
DATE
mm
Vivian Lai
Rikki
26-08-2014
1
2
3
4
5
6
A
B C D E F G H
PART No
NAME
SMD package to DIP Converter Board
TQFP32-100P-32-64P
38.0
side 1
2.54
Function:
TQFP(32-100pin) & TQFP(32-64pin) package to DIP
Technical Data:
Board Material FR-4
TQFP(32-100pin) (side1)
TQFP(32-64pin) (side2)
0.5mm (side 1)
0.8mm (side 2)
Board Thickness 1.6mm ± 0.1mm
Surface Technioque Spray tin 5-8um
Copper Thickness 35um ± 5um
Solderability 260°C at 3s - 1.1%
Flammability V-0
Surface Resistivity 1.0 x 106 MΩ
Volume Resistivity 1.0 x 108 MΩ - cm
Arc Resistance 125sec.
SMD package
Pitch
12
0.5mm
TQFP(32-100Pin)
21
6
side 2
46.0
8
10
12
14
18
16
17
15
13
11
9
7
5
33
46
mm ±0.2
2019
2221
2423
26
25
59
61
60
62
64
5758
5556
5354
51
52
48
3129
27
41393735 49474543
50
949698
100
86889092
78
808284
93959799
85878991
77
7981
83
0.8mm
TQFP(32-64Pin)
1
3
5
7
9
13
11
14
12
10
8
6
4
2
20
31
1516
36
38
35
37
39
3433
18
28262422 3230
6163
53555759 4951
6264
54565860 50
52
3
1
4
2
28
30
32 34 36 38 40 42 44
66
68
70
72
74
76 75
73
71
69
67
65
63
2927
252321
19
17
41
43
45
47 48
46
44
42
40
10
12
14
18
16
20
22