Datasheet

PRODUCT RELEASE
SPECIFICATION / HTK-002
For product information please visit our website.
http://www.coolermaster.com
Thermal Compound Kit
Since air is known as a poor heat conductor, it
should be replaced by a more conductive
material to improve heat flow across thermal
interfaces.
High Performance
FEATURES
Suitable for CPU, chipsets on
Mainboard, VGA card, etc.
Easy to use
Zif Socket Templates ensure correct
applying area with various CPU socket
types.
Produces an even layer when using
applicator.
Dielectric.
Wide range of application
temperature
For industrial use only.
Keep out of the reach of children.
Do not swallow!
Avoid contact with eyes.
Please read the instructions prior to
installation.
Cautions
Cooler Master HTK-002 thermally
conductive compounds are grease-like
silicone materials, heavily filled with heat
conductive metal oxides. This combination
promotes high thermal conductivity, low
bleed and high-temperature stability.
These compounds resist changes in
consistency at temperatures up to 177 C
(350 F), maintaining a positive heat sink
seal to improve heat transfer from the
electronic device to the heat sink or
chassis, thereby, increasing the overall
efficiency of the device.
Color Gray
Viscosity (@25 C) 1400 P
Specific Gravity @ 25 C
2.63 g/cm
3
Bulk Thermal Conductivity >4.5 W/m-K
Thermal Impedance ~0.02 C-in/W
Volume Resistivity
5.0 x 10
15
Ωcm
Dielectric Properties (Dielectric
constant @ 25 C, 100Hz)
Insulating >6
Shelf Life 24 months from DOM
Evaporation (200 C x 24hr) <0.35%
Revision: June 16th 2004