User's Manual
Table Of Contents
- Corning
- ONE™ Wireless Platform
- User Manual
- Preface Material
- About This Manual
- Hardware
- Software Warranty
- Returns
- Limitations of Liabilities
- Reporting Defects
- Warnings and Admonishments
- Regulatory Compliance Information
- RF Safety
- CAUTION!
- Laser Safety
- Licensee Contact Information
- Additional Relevant Documents
- Table of Contents
- 1 Introduction
- Figure 1-1. Illustration of Precise Service Distribution over Selected Remote Areas
- Table 1-17. Ethernet Path Units
- Figure 1-2. Corning ONE Wireless Platform Basic Architecture
- Figure 1-3. Corning® ONE™ Solution RF Path Architecture
- Figure 1-4. Corning ONE™ Solution Ethernet Path Architecture
- Figure 1-6. Illustration of Service Group Distribution
- Figure 1-7. Single Service Group Configuration
- Figure 1-8. Example of Dual Service Group Configuration
- Figure 1-9. Example of Three Service Group Configuration
- Figure 1-10. Example of Tri-Service Group Configuration with Two HEUs
- Figure 1-11. Example 1 of FMM-to-FRM Service Distribution
- Figure 1-12. Example 2 of FMM-to-FRM Service Distribution
- 2 Unit Descriptions - RF Path
- Figure 2-1. RF Path with HEU and OIU Headend Components
- Figure 2-2. RF Path with IHU Headend Component
- Figure 2-3. Example of HEU with Installed Modules
- Figure 2-4. HCM Module
- Figure 2-5. ACM Module
- Figure 2-6. RIM Module
- Figure 2-7.FRM
- Figure 2-8. RIX Expander Module Interfaces
- Figure 2-9. Expander Termination Module
- Figure 2-10. PSM-AC Power Supply Module
- PSM-DC
- Figure 2-11. DC Power Supply Module
- Figure 2-12. OIU Front Panel with Installed Modules
- Figure 2-13. Optical Interface Module
- Figure 2-14.FMM
- Figure 2-15. OIX Expander Module Interfaces
- Figure 2-16. IHU Front Panel with Installed Modules
- Figure 2-17. RF Path Remote-end Components
- Figure 2-18. ICU Front Panel Interfaces and Modules
- Figure 2-19. ICU Rear Panel Interfaces and PSM Modules
- Figure 2-20. RAU Module Interfaces
- Figure 2-21. RAU LEDs
- Table 2-19. RAU Status LEDs Description
- Figure 2-22. RAU5 Interfaces
- 3 Unit Descriptions - Ethernet Path
- Figure 3-2. CEU Front Panel with Installed CEM Module
- Figure 3-3. CEU Rear Panel
- Figure 3-5. CEM LEDs
- Figure 3-6. GEM Interfaces
- Figure 3-7. GEM LED Description
- Figure 3-8. GEU Enclosure: Top (Left) and Open Underside (Right)
- 4 Installation Guidelines
- Figure 4-1. Example of Communication Rack Installation
- Types of Power Supplies
- 5 Appendix E: Specifications
- RF Parameters for FCM Solution
- Optical Specifications
- Standards and Approvals
- RF Path: Coverage Component Specifications
- Fiber Connectivity Module (FCM) Specifications
- 6 Appendix F: Ordering Information
- HEU and OIU Assemblies and Modules
- Remote Units
- SFP+ Modules
- Ethernet Path Units
- Hardware
- Cable Ordering Information
- Cable Configurations
Introduction
CMA-331-AEN
Page 16
1.2 Key Features and Capabilities
• Comprehensive service support
• Supported services - LTE700, ESMR, CELL, PCS, AWS, WCS, and TDD 2500 MHz
• Flexible, configurable service distribution - advanced capacity and coverage management for better macro offload and
enhanced user experience.; Point-to-point connectivity and BTS hoteling in star topologies (via FCM modules)
• Fiber conservation – via FCM solution, enables single fiber transport of all RF services and 10 Gb Ethernet over a distance
of 12.4 mi
• Broadband enabled:
• A range of ready-made fiber-optic (and power) composite cables simplify installation at all levels
• Fiber backbone unleashes unlimited RF Spectrum
• Easy scales to higher speeds requirements
• Ethernet Support - dedicated fiber link for Ethernet backhaul, enables optimal use and offload of Wi-Fi
®
resources.
• Scalable and customizable - infrastructure can be quickly expanded to support more services or increase coverage without
downtime
• Carrier-grade network management:
• Single-source, remote end-to-end field upgradable platform
• Ready for SON, HetNet and future network requirements.
1.3 General System Specifications and Requirements
1.3.1 Environmental and Regulatory Specifications
1.3.1.1 Temperature and Humidity
The environmental specifications listed below are relevant to all Corning ONE™ solution devices.
Operating
Storage
Temperature 0°C to +50°C (32°F to 122°F) -20° C to 85° C (-4°F to 185°F)
Humidity 95% (non-condensing) 95% (non-condensing)
Table 1-1. Temperature and Humidity Specifications