Manualshelf

Datasheet

ManualsBrandsCREE ManualsHighPower-LEDsHighPower LED RGB, Cold white 8.2 lm, 30.6 lm, 67.2 lm, 100 lm 110 °, 115 ° 2.1 V, 3.4 V, 3.2 V, 3.2 V 350 mA M
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Copyright © 2008-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®v
, the Cree logo, XLamp
®
and EasyWhite
®
are
registered trademarks of Cree, Inc.
10
xlamp
®
mC-e leds
NOTES
Measurements
The luminous ux, radiant power, chromaticity and CRI measurements in this document are binning specications
only and solely represent product measurements as of the date of shipment. These measurements will change over
time based on a number of factors that are not within Cree’s control and are not intended or provided as operational
specications for the products. Calculated values are provided for informational purposes only and are not intended as
specications.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED
lumen maintenance. For information on the specic LM-80 data sets available for this LED, refer to the public LM-80
results document.
Moisture Sensitivity
Cree recommends keeping XLamp MC-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until
immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture
sensitivity.
Once the MBP is opened, XLamp MC-E LEDs should be
handled and stored as MSL 4 per JEDEC J-STD-033,
meaning they have limited exposure time before damage
to the LED may occur during the soldering operation.
The table on the right species the maximum exposure
time in days depending on temperature and humidity
conditions. LEDs with exposure time longer than the specied maximums must be baked according to the baking
conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
• LEDs that have been removed from the original MBP.
• LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
• LEDs that have not been soldered.
LEDs should be baked at 80 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before
baking. Do not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as dened
in the Moisture Sensitivity section above.
Temperature
Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
30 ºC 9 5 4 3 1 1 1
25 ºC 12 7 5 4 2 1 1
20 ºC 17 9 7 6 2 2 1