Datasheet
Copyright © 2008-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®v
, the Cree logo, XLamp
®
and EasyWhite
®
are
registered trademarks of Cree, Inc.
2
xlamp
®
mC-e leds
CHARACTERISTICS - COMPLETE PACKAGE
The following table lists the product characteristics for the XLamp MC-E LED package.
Characteristics Unit Minimum Typical Maximum
Thermal Resistance, junction to solder point - white °C/W 3
Thermal Resistance, junction to solder point - color °C/W 4
Viewing Angle (FWHM) - white degrees 110
Viewing Angle (FWHM) - color degrees 115
ESD withstand voltage (HBM per Mil-Std-883D) V 8000
LED Junction Temperature °C 150
CHARACTERISTICS - PER LED DIE (WHITE, EASYWHITE
®
, DYNAMIC WHITE)
The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package.
Characteristics Unit Minimum Typical Maximum
Temperature Coefcient of Voltage mV/°C -4
DC Forward Current mA 700
Reverse Voltage V 5
Forward Voltage (@ 350 mA) V 3.1 3.9
Forward Voltage (@ 700 mA) V 3.4
CHARACTERISTICS - PER LED DIE (COLOR)
The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package.
Characteristics Unit Red Green Blue White
Temperature Coefcient of Voltage mV/°C Typical -2 -4 -4 -4
DC Forward Current mA Maximum 700 700 700 700
Reverse Voltage V Maximum 5 5 5 5
Forward Voltage (@ 350 mA) V
Typical 2.1 3.4 3.2 3.1
Maximum 2.5 3.9 3.9 3.9
Forward Voltage (@ 700 mA) V Typical 2.3 3.7 3.5 3.5