Datasheet

2222
Copyright © 2012-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo, XLamp
®
, EasyWhite
®
and SC
3
Technology
®
are registered
trademarks of Cree, Inc.
22
XLamp
®
mK-R LEDs
REFLOW SOLDERING CHARACTERISTICS
Intesting,CreehasfoundXLampMK-RLEDstobecompatiblewithJEDECJ-STD-020C,usingtheparameterslistedbelow.Asageneral
guideline,Creerecommendsthatusersfollowtherecommendedsolderingproleprovidedbythemanufacturerofsolderpasteused.
NotethatthisgeneralguidelinemaynotapplytoallPCBdesignsandcongurationsofreowsolderingequipment.
Profile Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
toTp) 3°C/secondmax. 3°C/secondmax.
Preheat: Temperature Min (Ts
min)
100°C 150°C
Preheat: Temperature Max (Ts
max
) 150°C 200°C
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds
TimeMaintainedAbove:Temperature(TL) 183°C 217°C
TimeMaintainedAbove:Time(tL) 60-150seconds 60-150seconds
Peak/ClassicationTemperature(Tp) 215°C 260°C
TimeWithin5°CofActualPeakTemperature(tp) 10-30seconds 20-40 seconds
Ramp-Down Rate 6°C/secondmax. 6°C/secondmax.
Time25°CtoPeakTemperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
IPC/JEDECJ-STD-020C
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min