Datasheet

2121
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®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc.UL
®
and
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21
XLamp
®
mL-E LED
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp ML-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp) 1.2°C/second
Preheat: Temperature Min (Ts
min
) 120 °C
Preheat: Temperature Max (Ts
max
) 170 °C
Preheat: Time (ts
min
to ts
max
) 65-150 seconds
Time Maintained Above: Temperature (T
L
) 217 °C
Time Maintained Above: Time (t
L
) 45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25°C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reow temperatures (above) have been approved, Cree’s best practice guideline for reow is to use as low a
temperature as possible during the reow soldering process for these LEDs.
IPC/JEDEC J-STD-020C
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min