Datasheet

2222
Copyright © 2010-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc.UL
®
and
the UR logo are registered trademarks of UL LLC.
22
XLamp
®
mL-E LED
NOTES
Measurements
The luminous ux, radiant power, chromaticity and CRI measurements in this document are binning specications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Crees control and are not intended or provided as operational specications for the products. Calculated values are
provided for informational purposes only and are not intended as specications.

Please read the LED Reliability Overview for details of the qualication process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Crees pre-release qualication testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specic LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Crees lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp ML-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp ML-E LEDs should be handled and
stored as MSL 2a per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the soldering
operation. The table on the right species the maximum exposure time
in days depending on temperature and humidity conditions. LEDs with
exposure time longer than the specied maximums must be baked
according to the baking conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp ML-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.

Maximum Percent Relative Humidity
      
35 ºC - - - 17 1 .5 .5
30 ºC - - - 28 1 1 1
25 ºC - - - - 2 1 1
20 ºC - - - - 2 1 1