Datasheet

xlamp
®
mx-6s leds
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
8
Copyright © 2010-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
888
NOTES
Measurements
The luminous ux, radiant power, chromaticity and CRI measurements in this document are binning specications
only and solely represent product measurements as of the date of shipment. These measurements will change over
time based on a number of factors that are not within Cree’s control and are not intended or provided as operational
specications for the products. Calculated values are provided for informational purposes only and are not intended as
specications.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED
lumen maintenance. For information on the specic LM-80 data sets available for this LED, refer to the public LM-80
results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing
and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient
temperature and drive current affect the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp MX-6S LEDs in the provided, resealable moisture-barrier packaging (MBP) until
immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture
sensitivity.
Once the MBP is opened, XLamp MX-6S LEDs should be handled
and stored as MSL 2a per JEDEC J-STD-033, meaning they
have limited exposure time before damage to the LED may
occur during the soldering operation. The table on the right
species the maximum exposure time in days depending on
temperature and humidity conditions. LEDs with exposure time
longer than the specied maximums must be baked according
to the baking conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp MX-6S LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before
baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as dened
in the Moisture Sensitivity section above.
Temp.
Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
35 ºC - - - 17 1 .5 .5
30 ºC - - - 28 1 1 1
25 ºC - - - - 2 1 1
20 ºC - - - - 2 1 1