Datasheet

Copyright © 2011-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
13
xlamp
®
xB-D leDs
13
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp) 3 °C/second max. 3 °C/second max.
Preheat: Temperature Min (Ts
min
) 100 °C 150 °C
Preheat: Temperature Max (Ts
max
) 150 °C 200 °C
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (T
L
) 183 °C 217 °C
Time Maintained Above: Time (t
L
) 60-150 seconds 60-150 seconds
Peak/Classication Temperature (Tp) 215 °C 260 °C
Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate 6 °C/second max. 6 °C/second max.
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min