Datasheet

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18
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REFLOW SOLDERING CHARACTERISTICS
      

manufacturer of solder paste used.

Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts

  

min
 100 °C 150 °C


 150 °C 200 °C

min
to ts

  

L
  217 °C

L
  
 215 °C 
  
Ramp-Down Rate  
Time 25 °C to Peak Temperature  
