Datasheet
CLD-DS97 REV 1B
PRODUCT FAMILY DATA SHEET
Cree
®
XLamp
®
XP-L LEDs
WWW.CREE.COM/XLAMP
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
PRODUCT DESCRIPTION
The XLamp
®
XP-L LED is the highest
performing discrete in Cree’s
High-Density (HD) class of LEDs,
delivering the next generation of
lumen output and efcacy in the
compact 3.45 mm x 3.45 mm
XP footprint. Cree’s family of HD
discrete LEDs offers the industry’s
highest optical control factor (OCF),
a measurement of how LED size
and performance benet directional
lighting applications. High-OCF
LEDs enable lighting manufacturers
to improve the performance of
any lighting design, create smaller
and less expensive systems, and
develop new lighting solutions that
were previously not possible.
FEATURES
• Available in white, 70-CRI white,
80-CRI white, 85 CRI white and
90-CRI white
• ANSI-compatible chromaticity
bins
• Binned at 85 °C
• Maximum drive current:
3000 mA
• Low thermal resistance:
2.5 °C/W
• Wide viewing angle: 125°
• Unlimited oor life at
≤ 30 ºC/85% RH
• Reow solderable - JEDEC
J-STD-020C
• Electrically neutral thermal path
• RoHS- and REACh-compliant
• UL
®
recognized component
(E349212)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
Copyright © 2014-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc. UL
®
and the UR logo are registered trademarks of
UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
TABLE OF CONTENTS
Characteristics .......................... 2
Flux Characteristics .................... 3
Relative Spectral Power
Distribution............................... 4
Relative Flux vs. Junction
Temperature ............................. 4
Electrical Characteristics ............. 5
Relative Flux vs. Current ............ 5
Relative Chromaticity vs. Current . 6
Relative Chromaticity vs.
Temperature ............................. 6
Typical Spatial Distribution .......... 7
Thermal Design ......................... 7
Reow Soldering Characteristics .. 8
Notes ....................................... 9
Mechanical Dimensions..............11
Tape and Reel ..........................13
Packaging ................................14