Installation guide
Crestron HD-XSP 7.1 High-Definition Professional Surround Processor
Operations & Installation Guide – DOC. 7446A 7.1 High-Definition Surround Processor: HD-XSP • 11
HD-XSP Specifications (Continued)
SPECIFICATION DETAILS
Power Requirements
Power Pack 2.0 A @ 24 Vdc,100-240 Vac,
50/60 Hz power pack included
Environmental
Temperature 41º to 104º F (5º to 40º C)
Humidity 10% to 90% RH (non-condensing)
Heat Dissipation 65 Btu/h
Enclosure
Chassis Metal with black finish, vented sides
Front Panel Metal with black finish and polycarbonate
label overlay
Mounting Freestanding or 1U 19-inch rack-mountable
(feet and rack ears included)
Dimensions
Height 1.72 in (44 mm) without feet
Width 19 in (483 mm) with rack ears
Depth 10.23 in (260 mm)
Weight 4.2 lbs (1.9 kg)
Included Accessory
Power Pack 24 Vdc, Universal
Available Accessories
AMP Series Commercial Power Amplifiers
CBL Series Crestron Certified Interface Cables
HD-MD8X1 QuickSwitch HD 8x1 HDMI Switcher
PROAMP Series PROCISE High-Definition Surround Sound
Amplifiers
* HDMI requires an appropriate adapter or interface cable to accommodate a DisplayPort Multimode
signal.
Physical Description
This section provides information on the connections, controls and indicators
available on the HD-XSP.
HD-XSP Physical View