Product Specs

Subject
Product Specification
Rev
1.
0
Marketing
Name
M32
HomeKit Wi
-
Fi
module
Model No.
FWS703
Page
4
of
11
Description
M32 Wi
-
Fi
2.4GHz
module
support HomeKit
IO0 25 I/O
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4 26 I/O
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,SD_DATA1,
EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5,VSPICS0,HS1_DATA6,EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
3. Functional Description
This chapter describes the modules and functions
3.1 CPU and Internal Memory
M32 contains two low-power Xtensa® 32-
bit LX6 microprocessors. The internal memory
includes:
• 448 kB of ROM for booting and core functions.
• 520 kB (8 kB RTC FAST Memory included) of on-chip SRAM for data and instruction.
• 8 kB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the
co-processor during the Deep-sleep mode.
• 1 Kbit of eFuse, of which 320 bits are used for the system (MAC address and chip
configuration) and the remaining 704 bits are reserved for customer applications,
including Flash-Encryption and Chip-ID.
3.2 External Flash and SRAM
Note:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely , GPIO6 to GPIO11 ar e
connected to the integrated SPI flash integrated on M32 and ar e not r ecommended for other uses.