User's Manual
Table Of Contents
- General Description
- Benefits
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Bluetooth Baseband Core
- Infrared Modulator
- Infrared Learning
- Wireless Charging
- Security
- Support for NFC Tag Based Pairing
- Bluetooth Smart Audio
- ADC Port
- Serial Peripheral Interface
- Microprocessor Unit
- Integrated Radio Transceiver
- Peripheral Transport Unit
- GPIO Port
- PWM
- Power Management Unit
- Electrical Characteristics
- RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-xxxxx Rev. ** Page 26 of 42
PRELIMINARY
CYBLE-013025-00
CYBLE-013030-00
Table 16 shows the specifications for the digital voltage levels.
1. LSBs are expressed at the 10-bit level.
Table 16. Digital Levels
1
1. This table is also applicable to VDDMEM domain.
Characteristics Symbol Min Typ Max Unit
Input low voltage V
IL
––0.4V
Input high voltage V
IH
0.75 × VDDO – – V
Input low voltage (VDDO = 1.62V) V
IL
––0.4V
Input high voltage (VDDO = 1.62V) V
IH
1.2 ––V
Output low voltage
2
2. At the specified drive current for the pad.
V
OL
––0.4V
Output high voltage
2
V
OH
VDDO – 0.4 – – V
Input capacitance (VDDMEM domain) C
IN
–0.12–pF