User's Manual
Table Of Contents
- General Description
- Benefits
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Bluetooth Baseband Core
- Infrared Modulator
- Infrared Learning
- Wireless Charging
- Security
- Support for NFC Tag Based Pairing
- Bluetooth Smart Audio
- ADC Port
- Serial Peripheral Interface
- Microprocessor Unit
- Integrated Radio Transceiver
- Peripheral Transport Unit
- GPIO Port
- PWM
- Power Management Unit
- Electrical Characteristics
- RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-xxxxx Rev. ** Page 37 of 42
PRELIMINARY
CYBLE-013025-00
CYBLE-013030-00
Packaging
The CYBLE-0130XX-00 is offered in tape and reel packaging. Figure 19 details the tape dimensions used for the CYBLE-0130XX-00.
Figure 19. CYBLE-0130XX-00 Tape Dimensions (TBD)
Figure 20 details the orientation of the CYBLE-0130XX-00 in the tape as well as the direction for unreeling.
Figure 20. Component Orientation in Tape and Unreeling Direction (TBD)
Table 25. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles
CYBLE-0130XX-00 14-pad SMT 260 °C 30 seconds 2
Table 26. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBLE-0130XX-00 31-pad SMT MSL 3