User's Manual

Document Number: 002-xxxxx Rev. ** Page 8 of 42
PRELIMINARY
CYBLE-013025-00
CYBLE-013030-00
Module Connections
Tab l e 4 and Table 5 detail the solder pad connection definitions and available functions for the pad connections for the
CYBLE-013025-00 and CYBLE-013030-00 respectively. Table 4 and Tabl e 5 lists the solder pads on the CYBLE-0130XX-00 modules,
the silicon device pin, and denotes what functions are available for each solder pad.
Table 4. CYBLE-013025-00 Solder Pad Connection Definitions
Pad Num-
ber
Pad Name UART/SPI/I2C PWM GPIO Other Function
1 XRES Power Supply Input (3.30V)
2 GND/NC Ground Can be NC
3 GND/NC Ground Can be NC
4 P11/27 SPI2_MOSI(master/slave) 33ADC input, QOC, XTALI32K
5 P12/26 SPI2_CS(slave) 33ADC input, QOC, XTALO32K
6P15 3 ADC input, SWDIO, IR_RX
7 P14/38 SPI2_MOSI(master/slave) 33ADC Input, IR_TX
8P13/28 33ADC input, QOC, IR_TX
9P24
PUART_RX,SPI2_CLK(master/
slave))
3
10 NC Not Connect
11 NC Not Connect
12 P25
PUART_RX,SPI2_MISO(maste
r/slave)
3
13 P4
PUART_RX,SPI2_MOSI(maste
r/slave)
3 IR_TX, Q_Y0
14 P2
PUART_RX,SPI2_MOSI(maste
r)/SPI2_CS(slave)
3 QDX0
15 VDD VDD
16 P3
PUART_CTS,SPI2_CLK(maste
r/slave)
3 QDX1
17 P8/33 3 ADC input, TX_PD, QDX1,ACLK1
18 P32 3 ADC input, ACLK0
19 P1 PUART_RTS,SPI2_MISO 3 ADC input, IR_TX
20 P0
PUART_TX,SPI2_MOSI(master
/slave)
3 ADC input, IR_RX
21 SDA I2C_SDA 3
22 SCL I2C_SCL 3
23 UP_TX 3(UART_TXD) 3
24 UP_RX 3(UART_RXD) 3
25 GND Ground
26 GND Ground
27 GND Ground
28 GND Ground
29 NC Not Connect
30 NC Not Connect
31 NC Not Connect