User's Manual
Table Of Contents
- General Description
- Benefits
- More Information
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Bluetooth Baseband Core
- Microprocessor Unit
- Integrated Radio Transceiver
- Collaborative Coexistence
- Global Coexistence Interface
- Peripheral Transport Unit
- PCM Interface
- Clock Frequencies
- GPIO Port
- PWM
- Triac Control/PWM
- Serial Peripheral Interface
- Power Management Unit
- Electrical Characteristics
- RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-19525 Rev. ** Page 43 of 49
PRELIMINARY
CYBT-343026-01
CYBT-343029-01
CYBT-143038-01
Packaging
The CYBT-X430XX-01 is offered in tape and reel packaging. Figure 20 details the tape dimensions used for the CYBT-X430XX-01.
Figure 20. CYBT-X430XX-01 Tape Dimensions (TBD)
Figure 21 details the orientation of the CYBT-X430XX-01 in the tape as well as the direction for unreeling.
Figure 21. Component Orientation in Tape and Unreeling Direction (TBD)
Table 29. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles
CYBT-X430XX-01 24-pad SMT 260 °C 30 seconds 2
Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBT-X430XX-01 24-pad SMT MSL 3