Data Sheet

Table Of Contents
Document Number: 002-28053 Rev. ** Page 13 of 47
CYBT-343052-02
Multiple-Bonded GPIO Connections
The CYBT-343052-02 contains GPIOs, which are multiple-bonded at the silicon level. If any of these dual-bonded GPIOs are used,
only the functionality and features for one of these port pins may be used. The desired port pin should be configured in the WICED
Studio SDK. For details on the features and functions that each of these multiple-bonded GPIOs provide, refer to Table .
The following list details the multiple-bonded GPIOs available on the CYBT-343052-02 module:
PAD 1 P0/34: I2S_WS_PCM_SYNC/P0/P34 (triple bonded; only one of four is available)
PAD 2 I2C_SCL: I2S_PCM_OUT/P3/P29/P35 (quadruple bonded; only one of four is available)
PAD 4 I2C_SDA: I2S_PCM_IN/P12 (dual bonded; only one of two is available)
PAD 5 P2/P37/P28: I2S_PCM_CLK/P2/P28/P37 (quadruple bonded; only one of four is available)
PAD 11 GPIO_0: GPIO_0/P36/P38 (triple bonded; only one of three is available)
PAD 12 GPIO_1: GPIO_1/P25/P32 (triple bonded; only one of three is available)
PAD 14 GPIO_4: GPIO_4/LPO_IN/P6/P31 (quadruple bonded; only of four is available)
PAD 15 P4/P24: BT_CLK_REQ/P4/P24 (triple bonded; only one of three is available)
PAD 19 GPIO_7: GPIO_7/P30 (Dual bonded; only one of two is available)
PAD 22 GPIO_3: GPIO_3/P27/P33 (triple bonded; only one of three is available)
PAD 23 GPIO_6: GPIO_6/P11/P26 (triple bonded; only one of three is available)