Specifications
Table Of Contents
- CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Critical Components List
- Antenna Design
- Qualified Antenna for CYBT-263064-02 and CYBT-263065-02
- Bluetooth Baseband Core
- Power Management Unit
- Integrated Radio Transceiver
- Microcontroller Unit
- Peripherals and Communication Interfaces
- Electrical Characteristics
- Chipset RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-29354 Rev. ** Page 36 of 45
PRELIMINARY
CYBT-273063-02
CYBT-263064-02
CYBT-263065-02
Environmental Specifications
Environmental Compliance
This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBT-2X30XX-02 module is certified under the following RF certification standards:
■ FCC: WAP3063
■ ISED: 7922A-3063
■ MIC: TBD
■ CE
Safety Certification
The CYBT-2X30XX-02 module complies with the following safety regulations:
■ Underwriters Laboratories, Inc. (UL): Filing E331901
■ CSA
■ TUV
Environmental Conditions
Table 30 describes the operating and storage conditions for the Cypress Bluetooth module.
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Table 30. Environmental Conditions for CYBT-2X30XX-02
Description Minimum Specification Maximum Specification
Operating temperature −30 °C 85 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate
– 10 °C/minute
Storage temperature
–40 °C 85 °C
Storage temperature and humidity
– 85 °C at 85%
ESD: Module integrated into system Components
[21]
–
15 kV Air
2.0 kV Contact
Note
21. This does not apply to the RF pins (ANT).