Specifications
Table Of Contents
- CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Critical Components List
- Antenna Design
- Qualified Antenna for CYBT-263064-02 and CYBT-263065-02
- Bluetooth Baseband Core
- Power Management Unit
- Integrated Radio Transceiver
- Microcontroller Unit
- Peripherals and Communication Interfaces
- Electrical Characteristics
- Chipset RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-29354 Rev. ** Page 40 of 45
PRELIMINARY
CYBT-273063-02
CYBT-263064-02
CYBT-263065-02
Packaging
The CYBT-2X30XX-02 is offered in tape and reel packaging. Figure 20 details the tape dimensions used for the CYBT-2X30XX-02.
Figure 20. CYBT-2X30XX-02 Tape Dimensions
Figure 21 details the orientation of the CYBT-2X30XX-02 in the tape as well as the direction for unreeling.
Figure 21. Component Orientation in Tape and Unreeling Direction
Table 31. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles
CYBT-273063-02 35-pad SMT 260 °C 30 seconds 2
CYBT-263064-02 35-pad SMT 260 °C 30 seconds 2
CYBT-263065-02 35-pad SMT 260 °C 30 seconds 2
Table 32. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBT-273063-02 35-pad SMT MSL 3
CYBT-263064-02 35-pad SMT MSL 3
CYBT-263065-02 35-pad SMT MSL 3