CYBLE-343072-02, CYBLE-333073-02, CYBLE-333074-02 A I R O C ™ B l u etooth ® L E m o d u l e General description The CYBLE-3x307x-02 is a fully integrated Bluetooth® smart ready wireless module. The CYBLE-3x307x-02 includes an onboard crystal oscillator, passive components, flash memory, and the CYW20835 silicon device. Refer to the CYW20835 datasheet for additional details on the capabilities of the silicon device used in this module.
AIROC™ Bluetooth® LE module Benefits • Quadrature decoder • Watchdog timer (WDT) • 1x peripheral UART, 1x UART for programming and HCI • 1x SPI (master or slave mode) • 1x I2C master • One ADC (10-ENoB for DC measurement and 12-ENOB for Audio measurement) • Hardware security engine Benefits CYBLE-3x307x-02 provides all necessary components required to operate Bluetooth® LE communication standards.
AIROC™ Bluetooth® LE module Development environments Developmen t envi ronments ModusToolbox™ software is a modern, extensible development environment supporting a wide range of Infineon microcontroller devices. It provides a flexible set of tools and a diverse, high-quality collection of application-focused software. These include configuration tools, low-level drivers, libraries, and operating system support, most of which are compatible with Linux®, macOS®, and Windows®-hosted environments.
AIROC™ Bluetooth® LE module Contents Contents General description ...........................................................................................................................1 Module description............................................................................................................................1 Power consumption...........................................................................................................................1 Functional capabilities...........
AIROC™ Bluetooth® LE module Contents 8.8 Security engine .....................................................................................................................................................27 9 Keyboard scanner .........................................................................................................................29 9.1 Theory of operation ........................................................................................................................................
AIROC™ Bluetooth® LE module Overview 1 Overview 1.1 Functional block diagram Figure 1 illustrates the CYBLE-3x307x-02 functional block diagram. XRES UART SPI CYW20835 Silicon Device 12C PCM/12S ADC UP to 6 PWMs UP to 24 GPIOs Passive Components (RES, CAP, IND) 512 KB SERIAL FLASH 24 MHz XTAL 32kHz LPO_In (Optional) 1x MIPI DMI‐C interface Figure 1 Functional block diagram (GPIOs) 1.
AIROC™ Bluetooth® LE module Overview See Figure 2 for the mechanical reference drawing for CYBLE-3x307x-02. Figure 2 Module mechanical drawing Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended host PCB layout” on page 10. 3.
AIROC™ Bluetooth® LE module Pad connection interface 2 Pad connection interface As shown in the bottom view of Figure 2 on page 7, the CYBLE-3x307x-02 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBLE-3x307x-02 module.
AIROC™ Bluetooth® LE module Pad connection interface Figure 4 Recommended host PCB keepout area around the CYBLE-3x307x-02 antenna Preliminary Datasheet 9 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Recommended host PCB layout 3 Recommended host PCB layout Figure 5, Figure 6, Figure , and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-3x307x-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.26 mm (0.64 mm from center of the pad on either side) shown in Figure 4 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure .
AIROC™ Bluetooth® LE module Recommended host PCB layout Figure 6 CYBLE-3x307x-02 host layout (relative to origin) Table 3 provides the center location for each solder pad on the CYBLE-3x307x-02. All dimensions are referenced to the center of the solder pad. Refer to Figure 7 for the location of each module solder pad. Table 3 Module solder pad location Solder pad (center of pad) Location (X,Y) from origin (mm) Dimension from origin (mils) 1 (0.38, 7.21) (14.96, 283.86) 2 (0.38, 8.12) (14.
AIROC™ Bluetooth® LE module Recommended host PCB layout Table 3 Module solder pad location (continued) Solder pad (center of pad) Location (X,Y) from origin (mm) Dimension from origin (mils) 17 (2.15, 21.51) (84.65, 846.85) 18 (3.05, 21.51) (120.08, 846.85) 19 (3.95, 21.51) (155.51, 846.85) 20 (4.85, 21.51) (190.94, 846.85) 21 (5.75, 21.51) (226.38, 846.85) 22 (6.65, 21.51) (261.81, 846.85) 23 (7.56, 21.51) (297.64, 846.85) 24 (8.46, 21.51) (333.07, 846.85) 25 (9.36, 21.
AIROC™ Bluetooth® LE module Recommended host PCB layout Figure 7 Solder pad reference location Preliminary Datasheet 13 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Module connections 4 Module connections Table 4 details the solder pad connection definitions and available functions for the pad connections for the CYBLE-3x307x-02 module. Table 4 lists the solder pads on the CYBLE-3x307x-02 module, the silicon device pin, and denotes what functions are available for each solder pad.
AIROC™ Bluetooth® LE module Module connections Table 4 Pin assignments (continued) Module pad name Pad number HOST_WAKE 36 Silicon pin name BT_HOST_WAKE Power domain I/O O VDDO Description Host wake-up. This is a signal from the Bluetooth® device to the host indicating that the Bluetooth® device requires attention. • Asserted: Host device must wake up or remain awake • Deasserted: Host device may sleep when sleep awake criteria is met.
AIROC™ Bluetooth® LE module Module connections Table 5 GPIO pin descriptions (continued) Module Pad pad number name P10 16 Silicon pin name Direction Default POR state Power domain P10 Input Floating VDDO Default alternate function description GPIO: P10 A/D converter input 25 P11 15 P11 Input Floating VDDO GPIO: P11 A/D converter input 24 P12 14 P12 Input Floating VDDO GPIO: P12 A/D converter input 23 P13 13 P13 Input Floating VDDO GPIO: P13 A/D converter input 22 P14 42
AIROC™ Bluetooth® LE module Connections and optional external components 5 Connections and optional external components 5.1 Power connections (VDDIN) The CYBLE-3x307x-02 contains one power supply connection, VDDIN, which accepts a supply input range of 2.5 V to 3.6 V for CYBLE-3x307x-02. Table 12 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 12.
AIROC™ Bluetooth® LE module Connections and optional external components • If the XRES connection of the CYBLE-3x307x-02 module is not used in the application, a 10-µF capacitor may be connected to the XRES solder pad of the CYBLE-3x307x-02 to delay the XRES release. The capacitor value for this recommended implementation is approximate, and the exact value may differ depending on the VDDIN power supply ramp time of the system.
AIROC™ Bluetooth® LE module Connections and optional external components Figure 9 illustrates the CYBLE-3x307x-02 schematic. Figure 9 CYBLE-3x307x-02 schematic diagram 5.3 Critical components list Table 6 details the critical components used in the CYBLE-3x307x-02 module. Table 6 Critical component list Component Reference designator Silicon U1 60-pin QFN Bluetooth®/Bluetooth® LE silicon device CYW20835 Silicon U2 8-pin TDF8N, 512K Serial Flash Crystal Y1 24.
AIROC™ Bluetooth® LE module Connections and optional external components 5.4 Antenna design Table 7 details trace antenna used in the CYBLE-3x307x-02 module. For more information, see Table 7. Table 7 Trace antenna specifications Item Description Frequency range 2400–2500 MHz Peak gain –0.5-dBi typical Return loss 10-dB minimum Preliminary Datasheet 20 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Functional description 6 Functional description 6.1 Bluetooth® baseband core The Bluetooth® baseband core (BBC) implements all of the time-critical functions required for high-performance Bluetooth® LE 5.0 operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it, handles data flow control, schedules LL and TX/RX transactions, monitors Bluetooth® LE 5.
AIROC™ Bluetooth® LE module Functional description 6.1.2 Test mode support The CYBLE-3x307x-02 fully supports the Bluetooth® Test mode as described in Part I:1 of the Specification of the Bluetooth® System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth® Test Mode, the CYBLE-3x307x-02 also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing.
AIROC™ Bluetooth® LE module Functional description • File system information used for code, code patches, or data. The CYW20835 uses SPI Serial Flash for NVRAM storage. 6.2.4 Power-on reset (POR) The CYW20835 includes POR logic to allow the part to initialize correctly when power is applied. Figure 10 shows the sequence used by the CYW20835 during initialization. An small external cap may be used on RESET_N to add delay as VDDIO ramps up. 6.
AIROC™ Bluetooth® LE module Integrated radio transceiver 7 Integrated radio transceiver The CYBLE-3x307x-02 has an integrated radio transceiver that has been optimized for use in 2.4-GHz Bluetooth® wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4-GHz unlicensed ISM band. The CYBLE-3x307x-02 is fully compliant with the Bluetooth® LE 5.
AIROC™ Bluetooth® LE module Peripheral and communication interfaces 8 Peripheral and communication interfaces 8.1 I2C communication interface The CYBLE-3x307x-02 provides a 2-pin master I2C interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. This interface is compatible with I2C slave devices.
AIROC™ Bluetooth® LE module Peripheral and communication interfaces Table 9 Common baud rate examples, 24 MHz clock (continued) Baud rate (bps) Baud rate adjustment Mode Error (%) 0x00 Normal 0.16 0x00 0x00 Normal 0.16 0x01 0x00 Normal 0.00 High nibble Low nibble 115200 0x00 57600 38400 Table 10 contains example values to generate common baud rates with a 48 MHz UART clock.
AIROC™ Bluetooth® LE module Peripheral and communication interfaces SPI master device that supports 1.8 V or 3.3 V SPI slaves. The CYBLE-3x307x-02 can also act as an SPI slave device that supports a 1.8 V or 3.3 V SPI master. Note SPI voltage depends on VDDO/VDDM; therefore, it defines the type of devices that can be supported. 8.6 Infrared modulator The CYBLE-3x307x-02 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms.
AIROC™ Bluetooth® LE module Peripheral and communication interfaces • RSA encryption and decryption of modulus sizes up to 2048 bits • Elliptic curve Diffie-Hellman in prime field GF(p) • Generic modular math functions Preliminary Datasheet 28 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Keyboard scanner 9 Keyboard scanner The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host microcontroller to intervene. The scanner has the following features: • Ability to turn off its clock if no keys are pressed. • Sequential scanning of up to 160 keys in an 8 × 20 matrix. • Programmable number of columns from 1 to 20. • Programmable number of rows from 1 to 8.
AIROC™ Bluetooth® LE module Keyboard scanner - For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1. - For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1. - For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1. • Control of up to four external high-current GPIOs to power external optoelectronics: - Turn-on and turn-off time can be staggered for each HC-GPIO to avoid simultaneous switching of high currents and having multiple high-current devices on at the same time.
AIROC™ Bluetooth® LE module Clock frequencies 10 Clock frequencies The CYBLE-3x307x-02 has an integrated 24-MHz crystal on the module. There is no need to add an additional crystal oscillator. Preliminary Datasheet 31 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module GPIO port 11 GPIO port GPIO ports for this device is shown in Table 4-2. The CYBLE-3x307x-02 uses 24 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3 V or 4 mA at 1.8 V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3 V or 8 mA at 1.8 V. P28-P29, P32, P34, P38: all of these pins can be programmed as ADC inputs.
AIROC™ Bluetooth® LE module PWM 12 PWM The CYBLE-3x307x-02 has four PWMs. The PWM module consists of the following: • PWM0-5. Each of the six PWM channels contains the following registers: - 16-bit initial value register (read/write) - 16-bit toggle register (read/write) - 16-bit PWM counter value register (read) • PWM configuration register shared among PWM0-5 (read/write).
AIROC™ Bluetooth® LE module Power management unit 13 Power management unit The Power management unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. 13.1 RF power management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4-GHz transceiver, which then processes the power-down functions accordingly. 13.
AIROC™ Bluetooth® LE module Electrical characteristics 14 Electrical characteristics Table 11 shows the maximum electrical rating for voltages referenced to VDDIN pad. Table 11 Maximum electrical rating Symbol Value VDDIN Rating – 3.795 Unit Voltage on input or output pin – VSS – 0.3 to VDD + 0.3 Operating ambient temperature range Topr –30 to +85 Storage temperature range Tstg –40 to +85 V °C Table 12 shows the power supply characteristics for the range TJ = 0 to 125 °C.
AIROC™ Bluetooth® LE module Chipset RF specifications 15 Chipset RF specifications All specifications in Table 15 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 15 Receiver RF Specifications Parameter Conditions Min Typ[7] Max Unit General Frequency range – 2402 – 2480 MHz RX sensitivity[8] – – –91.5 – – Maximum input GFSK, 1 Mbps – – –20 dBm Interference performance TBD Out-of-band blocking performance (CW)[9] 30 MHz–2000 MHz 0.
AIROC™ Bluetooth® LE module Chipset RF specifications Table 16 Transmitter RF Specifications (TBD) Parameter Conditions Min Typ Max Unit Frequency range – Class 1: GFSK TX power – 2402 – 2480 MHz – 10 – dBm Power control step – 2 4 8 dB 30 MHz to 1 GHz – – – –36.0[12] 1 GHz to 12.75 GHz – – – –30.0[13] 1.8 GHz to 1.9 GHz – – – –47.0 5.15 GHz to 5.3 GHz – – – –47.0 Conditions Min Typ Max Unit Frequency range N/A 2402 – 2480 MHz sense[14] GFSK, 0.
AIROC™ Bluetooth® LE module Timing and AC characteristics 16 Timing and AC characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. 16.1 UART timing Table 18 UART timing specifications Reference Characteristics Min Max 1 Delay time, UART_CTS_N low to UART_TXD valid – 1.50 2 Setup time, UART_CTS_N high before midpoint of stop bit – 0.67 3 Delay time, midpoint of stop bit to UART_RTS_N high – 1.
AIROC™ Bluetooth® LE module Timing and AC characteristics 16.2 SPI timing The SPI interface supports clock speeds up to 12 MHz Table 19 and Figure 14 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively.
AIROC™ Bluetooth® LE module Timing and AC characteristics Table 20 and Figure 15 show the timing requirements when operating in SPI Mode 1 and 3.
AIROC™ Bluetooth® LE module Timing and AC characteristics 16.
AIROC™ Bluetooth® LE module Timing and AC characteristics Table 22 Timing for I2S transmitters and receivers Transmitter Lower limit Clock Period T Receiver Upper limit Lower limit Upper limit Notes Min Max Min Max Min Max Min Max Ttr – – – Tr – – – 18 Master mode: Clock generated by transmitter or receiver HIGH tHC 0.35Ttr – – – 0.35Ttr – – – 19 LOWtLC 0.35Ttr – – – 0.35Ttr – – – 19 Slave mode: Clock accepted by transmitter or receiver HIGH tHC – 0.
AIROC™ Bluetooth® LE module Timing and AC characteristics Figure 17 I2S transmitter timing Figure 18 I2S receiver timing Preliminary Datasheet 43 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Environmental specifications 17 Environmental specifications 17.1 Environmental compliance This CYBLE-3x307x-02 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this module are RoHS and HF compliant. 17.2 RF certification The CYBLE-3x307x-02 module will be certified under the following RF certification standards at production release.
AIROC™ Bluetooth® LE module Regulatory information 18 Regulatory information 18.1 FCC FCC NOTICE: The device CYBLE-3x307x-02 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.
AIROC™ Bluetooth® LE module Regulatory information RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antenna in Table 7, to alert users on FCC RF Exposure compliance.
AIROC™ Bluetooth® LE module Regulatory information Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme RSS exempte de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
AIROC™ Bluetooth® LE module Regulatory information 18.4 MIC Japan CYBLE-3x307x-02 is certified as a module with certification number 203-JNxxxx. End products that integrate CYBLE-3x307x-02 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. TBD Figure 19 MIC label Preliminary Datasheet 48 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Packaging 19 Packaging Table 24 Solder Reflow peak temperature Module part number Package Maximum peak temperature Maximum time at peak temperature No.
AIROC™ Bluetooth® LE module Packaging Figure 22 details reel dimensions used for the CYBLE-3x307x-02. Figure 22 Reel dimensions The CYBLE-3x307x-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-3x307x-02 is detailed in Figure 23. TBD Figure 23 CYBLE-3x307x-02 center of mass Preliminary Datasheet 50 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Ordering information 20 Ordering information Table 26 lists the CYBLE-3x307x-02 part number and features. Table 27 lists the reel shipment quantities for the CYBLE-3x307x-02.
AIROC™ Bluetooth® LE module Acronyms 21 Acronyms Table 28 Acronyms used in this document Acronym Description ADC analog-to-digital converter ADV advertising ALU arithmetic logic unit AMUXBUS analog multiplexer bus API application programming interface Arm® advanced RISC machine, a CPU architecture BLE Bluetooth® Low Energy Bluetooth® SIG Bluetooth® Special Interest Group BW bandwidth CAN Controller Area Network, a communications protocol CE European Conformity CMRR common-mode
AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description ILO internal low-speed oscillator, see also IMO IMO internal main oscillator, see also ILO INL integral nonlinearity, see also DNL IPOR initial power-on reset IPSR interrupt program status register IRQ interrupt request ITM instrumentation trace macrocell KC Korea Certification LCD liquid crystal display LIN Local Interconnect Network, a communications protocol.
AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description PRS pseudo random sequence PS port read data register PSoC® Programmable System-on-Chip™ PSRR power supply rejection ratio PWM pulse-width modulator QDID qualification design ID RAM random-access memory RISC reduced-instruction-set computing RMS root-mean-square RTC real-time clock RTL register transfer language RTR remote transmission request RX receive S/H sample and
AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description UDB universal digital block USB Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port VDAC voltage DAC, see also DAC, IDAC WDT watchdog timer WOL write once latch, see also NVL WRES watchdog timer reset XRES external reset I/O pin XTAL crystal Preliminary Datasheet 55 of 58 002-33419 Rev.
AIROC™ Bluetooth® LE module Document conventions 22 Document conventions 22.
AIROC™ Bluetooth® LE module Revision History Revision History Document version Date of release ** 2021-07-22 Preliminary Datasheet Description of changes Initial release 57 of 58 002-33419 Rev.
Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2021-07-22 Published by Infineon Technologies AG 81726 Munich, Germany © 2021 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Go to www.cypress.com/support Document reference 002-33419 Rev.
