Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 10 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Recommended host PCB layout
3 Recommended host PCB layout
Figure 5, Figure 6, Figure , and Table 3 provide details that can be used for the recommended host PCB layout
pattern for the CYBLE-3x307x-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.26 mm
(0.64 mm from center of the pad on either side) shown in Figure 4 is the minimum recommended host pad length.
The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure . It is not necessary to
use all figures to complete the host PCB layout pattern.
Figure 5 CYBLE-3x307x-02 host layout (dimensioned)