Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 11 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Recommended host PCB layout
Figure 6 CYBLE-3x307x-02 host layout (relative to origin)
Table 3 provides the center location for each solder pad on the CYBLE-3x307x-02. All dimensions are referenced
to the center of the solder pad. Refer to Figure 7 for the location of each module solder pad.
Table 3 Module solder pad location
Solder pad
(center of pad)
Location (X,Y) from
origin (mm)
Dimension from
origin (mils)
1 (0.38, 7.21) (14.96, 283.86)
2 (0.38, 8.12) (14.96, 319.68)
3 (0.38, 9.02) (14.96, 355.12)
4 (0.38, 9.92) (14.96, 390.55)
5 (0.38, 10.82) (14.96, 425.98)
6 (0.38, 11.72) (14.96, 461.42)
7 (0.38, 12.62) (14.96, 496.85)
8 (0.38, 13.53) (14.96, 532.68)
9 (0.38, 14.43) (14.96, 568.11)
10 (0.38, 15.33) (14.96, 603.54)
11 (0.38, 16.23) (14.96, 638.54)
12 (0.38, 17.13) (14.96, 674.41)
13 (0.38, 18.03) (14.96, 709.84)
14 (0.38, 18.94) (14.96, 745.67)
15 (0.38, 19.84) (14.96, 781.10)
16 (1.24, 21.51) (48.82, 846.85)