Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 12 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Recommended host PCB layout
17 (2.15, 21.51) (84.65, 846.85)
18 (3.05, 21.51) (120.08, 846.85)
19 (3.95, 21.51) (155.51, 846.85)
20 (4.85, 21.51) (190.94, 846.85)
21 (5.75, 21.51) (226.38, 846.85)
22 (6.65, 21.51) (261.81, 846.85)
23 (7.56, 21.51) (297.64, 846.85)
24 (8.46, 21.51) (333.07, 846.85)
25 (9.36, 21.51) (368.50, 846.85)
26 (10.26, 21.51) (403.94, 846.85)
27 (11.16, 21.51) (439.37, 846.85)
28 (12.07, 21.51) (475.20, 846.85)
29 (12.93, 19.84) (509.05, 781.10)
30 (12.93, 18.94) (509.05, 745.67)
31 (12.93, 18.03) (509.05, 709.84)
32 (12.93, 17.13) (509.05, 674.41)
33 (12.93, 16.23) (509.05, 638.98)
34 (12.93, 15.33) (509.05, 603.54)
35 (12.93, 14.43) (509.05, 568.11)
36 (12.93, 13.53) (509.05, 532.68)
37 (12.93, 12.62) (509.05, 496.85)
38 (12.93, 11.72) (509.05, 461.42)
39 (12.93, 10.82) (509.05, 425.98)
40 (12.93, 9.92) (509.05, 390.55)
41 (12.93, 9.02) (509.05, 355.12)
42 (12.93, 8.12) (509.05, 319.68)
43 (12.93, 7.21) (509.05, 283.86)
Table 3 Module solder pad location
(continued)
Solder pad
(center of pad)
Location (X,Y) from
origin (mm)
Dimension from
origin (mils)