Data Sheet

Preliminary Datasheet 14 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Module connections
4 Module connections
Table 4 details the solder pad connection definitions and available functions for the pad connections for the
CYBLE-3x307x-02 module. Table 4 lists the solder pads on the CYBLE-3x307x-02 module, the silicon device pin,
and denotes what functions are available for each solder pad.
Table 4 Pin assignments
Module pad
name
Pad
number
Silicon pin name I/O
Power
domain
Description
Microphone Microphone
MIC_AVDD 24 MIC_AVDD I MIC_AVDD Microphone supply
MIC_BIAS 27 MICBIAS O MIC_AVDD Microphone bias supply
MIC_N 25 MICN I MIC_AVDD Microphone negative input
MIC_P 26 MICP I MIC_AVDD Microphone positive input
GND_A 23 28 Analog ground for microphone
Power supply
VDD 2 2.5V~3.6V
Ground pins Ground pins
GND 1 19 22 43 HS-VSS I VSS Digital ground
UART UART
UART_CTS_N 29 UART_CTS_N I, PU VDDO CTS for HCI UART interface: NC if
unused.
UART_RTS_N 30 UART_RTS_N O, PU VDDO RTS for HCI UART interface. NC if
unused.
UART_RXD 32 UART_RXD I VDDO UART serial input. Serial data input
for the HCI
UART interface.
UART_TXD 31 UART_TXD O, PU VDDO UART serial input. Serial data input
for the HCI
UART interface.
Interface Serial peripheral
interface
SPI_MISO 33 SPI_MISO I VDDO SPI Master In Slave Out
NA NA SPI_MOSI O VDDO SPI Master Out Slave In
NA NA SPI_CSN O VDDO SPI Chip Select
NA NA SPI_CLK O VDDO SPI Clock
Crystal Crystal
NA NA BT_XTALI I PLLVDD1P2 Crystal oscillator input: see
“Crystal Oscillator” on page 12 for
options
NA NA BT_XTALO O PLLVDD1P2 Crystal oscillator output
XTALI_32K 20 XTALI_32K I VDDO Low-power oscillator input
XTALO_32K 21 XTALO_32K O VDDO Low-power oscillator output
Others Others
NA NA DEFAULT_STRAP I VDDO Connect to VDDO