Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 18 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Connections and optional external components
• If the XRES connection of the CYBLE-3x307x-02 module is not used in the application, a 10-µF capacitor may be
connected to the XRES solder pad of the CYBLE-3x307x-02 to delay the XRES release. The capacitor value for
this recommended implementation is approximate, and the exact value may differ depending on the VDDIN
power supply ramp time of the system. The capacitor value should result in an XRES release timing of 50 ms
after VDDIN stability.
• The XRES release timing may be controlled by an external voltage detection IC. XRES should be released 50 ms
after VDD is stable.
Refer to Figure on page 23 for XRES operating and timing requirements during power-on events.