Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 19 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Connections and optional external components
Figure 9 illustrates the CYBLE-3x307x-02 schematic.
Figure 9 CYBLE-3x307x-02 schematic diagram
5.3 Critical components list
Table 6 details the critical components used in the CYBLE-3x307x-02 module.
Table 6 Critical component list
Component Reference designator description
Silicon U1 60-pin QFN Bluetooth®/Bluetooth® LE silicon device -
CYW20835
Silicon U2 8-pin TDF8N, 512K Serial Flash
Crystal Y1 24.000 MHz, 12PF