Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 2 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Benefits
• Quadrature decoder
•Watchdog timer (WDT)
• 1x peripheral UART, 1x UART for programming and HCI
• 1x SPI (master or slave mode)
•1x I2C master
• One ADC (10-ENoB for DC measurement and 12-ENOB for Audio measurement)
• Hardware security engine
Benefits
CYBLE-3x307x-02 provides all necessary components required to operate Bluetooth® LE communication
standards.
• Proven ready-to-use hardware design
• Cost optimized for applications without space constraints
• Nonvolatile memory for self-sufficient operation and over-the-air updates
• Bluetooth® SIG listed with QDID and Declaration ID
• Fully certified module eliminates the time needed for design, development, and certification processes
• ModusToolbox™ provides an easy-to-use integrated design environment (IDE) to configure, develop, and
program a Bluetooth® application
More information
Infineon provides a wealth of data at www.cypress.com to help you to select the right module for your design,
and to help you to quickly and effectively integrate the module into your design.
References
•Overview: AIROC™ Bluetooth® LE & Bluetooth® portfolio, Module roadmap
• CYW20835 Bluetooth® silicon datasheet
•Development kits:
- CYBLE-343072-EVAL, CYBLE-343072-02 evaluation board
- CYBLE-333074-EVAL, CYBLE-333074-02 evaluation board
• Test and debug tools:
- CYSmart, Bluetooth® LE test and debug tool (Windows)
- CYSmart Mobile, Bluetooth® LE test and debug tool (Android/iOS Mobile App)
•Knowledge base article
- KBA97095 - EZ-Bluetooth® LE module placement
- TBD - TBD
- KBA213976 - FAQ for Bluetooth® LE and regulatory certifications with EZ-BLE modules
- KBA210802 - Queries on Bluetooth® LE qualification and declaration processes
- KBA218122 - 3D Model Files for EZ-BLE/EZ-BT modules
- TBD - Platform files for CYBLE-343072-EVAL and CYBLE-333074-EVAL
- KBA223428 - Programming an EZ-BT WICED module
Note
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interfer-
ence sources with output power of +12.0 dBm. Actual range will vary based on end product design, environ-
ment, receive sensitivity, and transmit output power of the central device.