Data Sheet

ManualsBrandsCypress Semiconductor ManualsElectronicsAIROC Bluetooth LE Module

Table Of Contents

General description
Module description
Power consumption
Functional capabilities
Benefits
More information
References
Development environments
Technical support
Contents
1 Overview
- 1.1 Functional block diagram
- 1.2 Module description
  - 1.2.1 Module dimensions and drawing
2 Pad connection interface
3 Recommended host PCB layout
4 Module connections
5 Connections and optional external components
- 5.1 Power connections (VDDIN)
  - Considerations and Optional Components for Brown Out (BO) Conditions
- 5.2 External reset (XRES)
- 5.3 Critical components list
- 5.4 Antenna design
6 Functional description
- 6.1 Bluetooth® baseband core
- 6.2 Microcontroller unit
- 6.3 External reset (XRES)
  - 6.3.1 Brownout detection
7 Integrated radio transceiver
- 7.1 Transmitter path
  - 7.1.1 Digital modulator
  - 7.1.2 Power amplifier
- 7.2 Receiver path
  - 7.2.1 Digital demodulator and bit synchronizer
  - 7.2.2 Receiver signal strength indicator
- 7.3 Local oscillator generation
- 7.4 Calibration
8 Peripheral and communication interfaces
- 8.1 I2C communication interface
- 8.2 HCI UART interface
- 8.3 Triac control
- 8.4 Peripheral UART interface
- 8.5 Serial peripheral interface
- 8.6 Infrared modulator
- 8.7 PDM microphone
- 8.8 Security engine
9 Keyboard scanner
- 9.1 Theory of operation
- 9.2 Mouse quadrature signal decoder
- 9.3 Theory of operation
- 9.4 ADC port
10 Clock frequencies
11 GPIO port
12 PWM
13 Power management unit
- 13.1 RF power management
- 13.2 Host controller power management
- 13.3 BBC power management
14 Electrical characteristics
15 Chipset RF specifications
16 Timing and AC characteristics
- 16.1 UART timing
- 16.2 SPI timing
- 16.3 I2C interface timing
17 Environmental specifications
- 17.1 Environmental compliance
- 17.2 RF certification
- 17.3 Safety certification
- 17.4 Environmental conditions
- 17.5 ESD and EMI protection
18 Regulatory information
- 18.1 FCC
- 18.2 ISED
- 18.3 European declaration of conformity
- 18.4 MIC Japan
19 Packaging
20 Ordering information
21 Acronyms
22 Document conventions
- 22.1 Units of measure
Revision History

Preliminary Datasheet 28 of 58 002-33419 Rev. **

2021-07-22

AIROC™ Bluetooth® LE module

Peripheral and communication interfaces

• RSA encryption and decryption of modulus sizes up to 2048 bits

• Elliptic curve Diffie-Hellman in prime field GF(p)

• Generic modular math functions