Data Sheet

Preliminary Datasheet 4 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Contents
Contents
General description ...........................................................................................................................1
Module description............................................................................................................................1
Power consumption...........................................................................................................................1
Functional capabilities.......................................................................................................................1
Benefits............................................................................................................................................2
More information ..............................................................................................................................2
References........................................................................................................................................2
Development environments ...............................................................................................................3
Technical support..............................................................................................................................3
Contents...........................................................................................................................................4
1 Overview .......................................................................................................................................6
1.1 Functional block diagram.......................................................................................................................................6
1.2 Module description.................................................................................................................................................6
1.2.1 Module dimensions and drawing........................................................................................................................6
2 Pad connection interface.................................................................................................................8
3 Recommended host PCB layout......................................................................................................10
4 Module connections ......................................................................................................................14
5 Connections and optional external components..............................................................................17
5.1 Power connections (VDDIN) .................................................................................................................................17
5.2 External reset (XRES) ............................................................................................................................................17
5.3 Critical components list........................................................................................................................................19
5.4 Antenna design .....................................................................................................................................................20
6 Functional description ..................................................................................................................21
6.1 Bluetooth® baseband core ...................................................................................................................................21
6.1.1 Link control layer ...............................................................................................................................................21
6.1.2 Test mode support.............................................................................................................................................22
6.1.3 Frequency hopping generator ..........................................................................................................................22
6.2 Microcontroller unit..............................................................................................................................................22
6.2.1 Floating point unit .............................................................................................................................................22
6.2.2 OTP memory ......................................................................................................................................................22
6.2.3 NVRAM configuration data and storage............................................................................................................22
6.2.4 Power-on reset (POR) ........................................................................................................................................23
6.3 External reset (XRES) ............................................................................................................................................23
6.3.1 Brownout detection...........................................................................................................................................23
7 Integrated radio transceiver ..........................................................................................................24
7.1 Transmitter path...................................................................................................................................................24
7.1.1 Digital modulator...............................................................................................................................................24
7.1.2 Power amplifier..................................................................................................................................................24
7.2 Receiver path ........................................................................................................................................................24
7.2.1 Digital demodulator and bit synchronizer........................................................................................................24
7.2.2 Receiver signal strength indicator ....................................................................................................................24
7.3 Local oscillator generation...................................................................................................................................24
7.4 Calibration.............................................................................................................................................................24
8 Peripheral and communication interfaces ......................................................................................25
8.1 I2C communication interface...............................................................................................................................25
8.2 HCI UART interface................................................................................................................................................25
8.3 Triac control..........................................................................................................................................................26
8.4 Peripheral UART interface....................................................................................................................................26
8.5 Serial peripheral interface....................................................................................................................................26
8.6 Infrared modulator ...............................................................................................................................................27
8.7 PDM microphone ..................................................................................................................................................27