Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 40 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Timing and AC characteristics
Table 20 and Figure 15 show the timing requirements when operating in SPI Mode 1 and 3.
Figure 15 SPI timing – mode 1 and 3
Table 20 SPI mode 1 and 3
Reference Characteristics Min Max Unit
1 Time from master assert SPI_CSN to first clock edge 45 –
ns
2 Hold time for MOSI data lines 12 ½ SCK
3 Time from last sample on MOSI/MISO to slave deassert SPI_INT 0 100
4 Time from slave deassert SPI_INT to master deassert SPI_CSN 0 –
5 Idle time between subsequent SPI transactions 1 SCK –
2
SPI_CSN
SPI_INT
(DirectWrite)
SPI_CLK
(Mode 1)
SPI_MOSI
Invalid bit
SPI_MISO
Not Driven
Invalid bit
First bit
First bit
Last bit
Last bit
1
3
4
5
Not Driven
SPI_CLK
(Mode 3)
SPI_INT
(DirectRead)