Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 44 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Environmental specifications
17 Environmental specifications
17.1 Environmental compliance
This CYBLE-3x307x-02 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous
Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this
module are RoHS and HF compliant.
17.2 RF certification
The CYBLE-3x307x-02 module will be certified under the following RF certification standards at production
release.
•FCC: TBD
•CE
•IC: TBD
•MIC: TBD
17.3 Safety certification
The CYBLE-3x307x-02 module complies with the following safety regulations:
• Underwriters Laboratories, Inc. (UL): Filing E331901
•CSA
•TUV
17.4 Environmental conditions
Table 23 describes the operating and storage conditions for the Bluetooth® LE module.
17.5 ESD and EMI protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings
in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD
protection and a low-impedance path to ground.
Device handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Table 23 Environmental conditions for CYBLE-3x307x-02
Description Minimum specification Maximum specification
Operating temperature –30 °C 85 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate – 3 °C/minute
Storage temperature –40 °C 85 °C
Storage temperature and humidity – 85 °C at 85%
ESD: Module integrated into end system
Components
[24]
–
15 kV Air
2.0 kV Contact
Note
24.This does not apply to the RF pins (ANT).