Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 48 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Regulatory information
18.4 MIC Japan
Figure 19 MIC label
CYBLE-3x307x-02 is certified as a module with certification number 203-JNxxxx. End products that integrate
CYBLE-3x307x-02 do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
TBD