Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 49 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Packaging
19 Packaging
The CYBLE-3x307x-02 is offered in tape and reel packaging. Figure 20 details the tape dimensions used for the
CYBLE-3x307x-02.
Figure 20 CYBLE-3x307x-02 tape dimensions
Figure 21 details the orientation of the CYBLE-3x307x-02 in the tape as well as the direction for unreeling.
Figure 21 Component orientation in tape and unreeling direction
Table 24 Solder Reflow peak temperature
Module
part number
Package
Maximum peak
temperature
Maximum time at peak
temperature
No. of cycles
CYBLE-343072-02 43-pad SMT 260 °C 30 seconds 2
CYBLE-333073-02 45-pad SMT 260 °C 30 seconds 2
CYBLE-333074-02 43-pad SMT 260 °C 30 seconds 2
Table 25 Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module part number Package MSL
CYBLE-343072-02 43-pad SMT MSL 3
CYBLE-333073-02 45-pad SMT MSL 3
CYBLE-333074-02 43-pad SMT MSL 3