Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 5 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Contents
8.8 Security engine .....................................................................................................................................................27
9 Keyboard scanner .........................................................................................................................29
9.1 Theory of operation..............................................................................................................................................29
9.1.1 Idle......................................................................................................................................................................29
9.1.2 Scan ....................................................................................................................................................................29
9.1.3 Scan End.............................................................................................................................................................29
9.2 Mouse quadrature signal decoder .......................................................................................................................29
9.3 Theory of operation..............................................................................................................................................30
9.4 ADC port ................................................................................................................................................................30
10 Clock frequencies........................................................................................................................31
11 GPIO port ...................................................................................................................................32
12 PWM...........................................................................................................................................33
13 Power management unit .............................................................................................................34
13.1 RF power management ......................................................................................................................................34
13.2 Host controller power management .................................................................................................................34
13.3 BBC power management....................................................................................................................................34
14 Electrical characteristics .............................................................................................................35
15 Chipset RF specifications .............................................................................................................36
16 Timing and AC characteristics ......................................................................................................38
16.1 UART timing ........................................................................................................................................................38
16.2 SPI timing ............................................................................................................................................................39
16.3 I2C interface timing.............................................................................................................................................41
17 Environmental specifications.......................................................................................................44
17.1 Environmental compliance................................................................................................................................44
17.2 RF certification....................................................................................................................................................44
17.3 Safety certification..............................................................................................................................................44
17.4 Environmental conditions..................................................................................................................................44
17.5 ESD and EMI protection......................................................................................................................................44
18 Regulatory information ...............................................................................................................45
18.1 FCC.......................................................................................................................................................................45
18.2 ISED......................................................................................................................................................................46
18.3 European declaration of conformity..................................................................................................................47
18.4 MIC Japan............................................................................................................................................................48
19 Packaging ..................................................................................................................................49
20 Ordering information ..................................................................................................................51
21 Acronyms ...................................................................................................................................52
22 Document conventions................................................................................................................56
22.1 Units of measure.................................................................................................................................................56
Revision History ..............................................................................................................................57