Data Sheet

Preliminary Datasheet 6 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Overview
1Overview
1.1 Functional block diagram
Figure 1 illustrates the CYBLE-3x307x-02 functional block diagram.
Figure 1 Functional block diagram (GPIOs)
1.2 Module description
The CYBLE-3x307x-02 module is a complete module designed to be soldered to the application’s main board.
1.2.1 Module dimensions and drawing
Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module
functionality. Such selections will still guarantee that all mechanical specifications and module certifications are
maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure
2 on page 7. All dimensions are in millimeters (mm).
Table 1 Module design dimensions
Dimension item Specification
Module dimensions Length (X) 13.31 ± 0.15 mm
Width (Y) 21.89 ± 0.15 mm
Antenna connection location dimensions Length (X) 13.31 mm
Width (Y) 4.65 mm
PCB thickness Height (H) 0.50 ± 0.05 mm
Shield height Height (H) 1.45-mm typical
Maximum component height Height (H) 1.45-mm typical
Total module thickness (bottom of module to highest
component)
Height (H) 1.95-mm typical
CYW20835
Silicon Device
Passive Components
(RES, CAP, IND)
512 KB
SERIAL FLASH
24 MHz
XTAL
XRES
UART
SPI
12C
PCM/12S
ADC
UPto6PWMs
UPto24 GPIOs
32kHzLPO_In
(Optional)
1xMIPIDMI‐C
interface