Data Sheet
Table Of Contents
- General description
- Module description
- Power consumption
- Functional capabilities
- Benefits
- More information
- References
- Development environments
- Technical support
- Contents
- 1 Overview
- 2 Pad connection interface
- 3 Recommended host PCB layout
- 4 Module connections
- 5 Connections and optional external components
- 6 Functional description
- 7 Integrated radio transceiver
- 8 Peripheral and communication interfaces
- 9 Keyboard scanner
- 10 Clock frequencies
- 11 GPIO port
- 12 PWM
- 13 Power management unit
- 14 Electrical characteristics
- 15 Chipset RF specifications
- 16 Timing and AC characteristics
- 17 Environmental specifications
- 18 Regulatory information
- 19 Packaging
- 20 Ordering information
- 21 Acronyms
- 22 Document conventions
- Revision History
Preliminary Datasheet 7 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Overview
See Figure 2 for the mechanical reference drawing for CYBLE-3x307x-02.
Figure 2 Module mechanical drawing
Notes
2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located
beneath the antenna area. For more information on recommended host PCB layout, see “Recommended
host PCB layout” on page 10.
3. The CYBLE-343072-02, CYBLE-333073-02, CYBLE-333074-02 includes castellated pad connections, denoted
as the circular openings at the pad location above.