Data Sheet

Preliminary Datasheet 8 of 58 002-33419 Rev. **
2021-07-22
AIROC™ Bluetooth® LE module
Pad connection interface
2Pad connection interface
As shown in the bottom view of Figure 2 on page 7, the CYBLE-3x307x-02 connects to the host board via solder
pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimen-
sions of the CYBLE-3x307x-02 module.
Figure 3 Solder pad dimensions (seen from bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. Antenna Area Keepout: The host board directly below the antenna area of the module (see Figure 2 on page
7) must not contain ground or signal traces. This keepout area requirement applies to all layers of the host
board.
2. Module Placement: The ideal placement of the Bluetooth® module is in a corner of the host board with the PCB
trace antenna located at the far corner. This placement minimizes the additional recommended keepout area
stated in item 2. Refer to AN96841 for module placement best practices.
Table 2 Connection description
Part number Name Connections Connection type
Pad length
dimension
Pad width
dimension
Pad pitch
CYBLE-343072-02 SP 43 Solder pads 1.02 mm 0.61 mm 0.90 mm
CYBLE-333073-02 SP 45 Solder pads 1.02 mm 0.61 mm 0.90 mm
CYBLE-333074-02 SP 43 Solder pads 1.02 mm 0.61 mm 0.90 mm