User's Manual
Table Of Contents
- General Description
- Benefits
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Bluetooth Baseband Core
- Power Management Unit
- Microprocessor Unit
- Integrated Radio Transceiver
- Peripheral Transport Unit
- ADC Port
- PWM
- Triac Control
- Security Engine
- Electrical Characteristics
- RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-19043 Rev. PRELIMINARY Page 24 of 33
PRELIMINARY
CYBLE-413136-01
Environmental Specifications
Environmental Compliance
This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-413136-01 module is certified under the following RF certification standards:
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FCC: WAP3136 (pending)
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IC: 7922A-3136 (pending)
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CE (pending)
Safety Certification
The CYBLE-413136-01 module complies with the following safety regulations:
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Underwriters Laboratories, Inc. (UL): Filing E331901
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CSA
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TUV
Environmental Conditions
Tab le 19 describes the operating and storage conditions for the Cypress BLE module.
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Table 19. Environmental Conditions for CYBLE-413136-01
Description Minimum Specification Maximum Specification
Operating temperature −30 °C 105 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate
– 3 °C/minute
Storage temperature
–30 °C 110 °C
Storage temperature and humidity – 110 °C at 85%
ESD: Module integrated into system Components
[6]
–
15 kV Air
2.0 kV Contact
Note
6. This does not apply to the RF pins (ANT).